Process Engineer 3

Mattson Technology, Inc.

Singapore

On-site

SGD 120,000 - 180,000

Full time

2 days ago
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Job summary

Mattson Technology, Inc. in Singapore seeks an experienced process engineer to develop and optimize plasma etch/CVD processes, achieving targets for film quality, etch rate, uniformity, selectivity, and profile.

You will define specifications and operational windows for next‑gen reactors and guide suppliers to optimize critical components. The role requires a Master’s or PhD in Chemical Engineering or Materials Science with 5+ years of relevant experience, strong communication, and hands-on

Qualifications

  • Master's or PhD in Chemical Engineering or Materials Science.
  • Minimum 5 years of relevant experience.
  • Strong oral and written communication.
  • Experience with structured problem-solving tools (RCA, Six Sigma, 5 Whys).
  • Familiar with semiconductor process and characterization tools (SEM, OES).
  • Hands-on wafer handling, chamber maintenance, and basic mechanical/gas-line assembly.

Responsibilities

  • Develop and optimize plasma processes to meet critical film, etch rate, uniformity, selectivity, and profile targets.
  • Generate process specifications and define operational windows for next-generation semiconductor reactors.
  • Drive hardware and subsystem suppliers to evaluate and optimize process-critical components (e.g., showerheads, gas delivery, pressure control).
  • Develop new process regimes and chemistry strategies to expand reactor capabilities for advanced technology nodes.
  • Design DOE to identify and mitigate defectivity, wafer damage, and plasma instability issues.
  • Material and precursor selection to evaluate new gas chemistry combinations and material compatibility.
  • Understand process metrology and diagnostic techniques (e.g., OES, mass spec) to characterize plasma properties and integrate end-point control.
  • Support cost-of-ownership reduction programs through process optimization, gas consumption reduction, and process transfer to lower-cost hardware platforms.
  • Work closely with cross-functional teams including mechanical engineers, software engineers, and product managers to define and implement initiatives.

Skills

Problem-solving
Strong communication
Cross-functional collaboration

Education

Master's or PhD in Chemical Engineering, Materials Science or related field

Tools

SEM
Mass spectrometry
OES

Job description

Key Responsibilities:
  • Develop and optimize plasma processes (etch/CVD) to achieve critical film, etch rate, uniformity, selectivity, and profile performance targets
  • Generate process specifications and define operational windows for next-generation semiconductor reactors
  • Drive hardware and subsystem suppliers to evaluate and optimize process-critical components (e.g., showerheads, gas delivery, pressure control)
  • Develop new process regimes and chemistry strategies to expand reactor capabilities for advanced technology nodes
  • Design process experiments (DOE) to identify and mitigate defectivity, wafer damage, and plasma instability issues
  • Material and precursor selection to evaluate new gas chemistry combinations and material compatibility for advanced film application
  • Understand process metrology and diagnostic techniques (e.g., OES, mass spec) to characterize plasma properties and integrate end-point control
  • Support cost-of-ownership reduction programs through process optimization, gas consumption reduction, and process transfer to lower-cost hardware platforms.
  • Work closely with cross-functional teams including mechanical engineers, software engineers, and product Managers to define and implement initiatives.
The job incumbent should possess:
  • A Masters or PhD in Chemical Engineering, Material Science or a closely related field with at least 5 years of relevant industry or academic experience.
  • Strong oral and written communication abilities, with the capability to present complex ideas clearly and effectively.
  • Demonstrated experience in applying structured problem-solving tools and methodologies (e.g., Root Cause Analysis, Six Sigma, Fishbone Diagram, 5 Whys).
  • Familiar with semiconductor process and characterization tools (e.g. SEM, film thickness/stress measurement, plasma diagnostic tools, OES) will be a plus
  • Familiar with material properties, thin film characterization, and plasma chemistry dynamics
  • Hands-on skills in wafer handling, chamber maintenance, manual tool operation, and basic mechanical/gas-line assembly will be a plus
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