Process Engineer

PYXIS CF PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A leading company in semiconductor solutions is seeking an experienced Process Engineer who will optimize and enhance assembly processes. The role involves leading cross-functional teams and requires a Master’s degree in Engineering or related fields. Candidates should be proficient in statistical analysis and communication to collaborate effectively with stakeholders, supported by a strong background in high-volume manufacturing.

Qualifications

• Master’s degree in a relevant field required.
• Experience in high-volume precision manufacturing and semiconductor industries.
• Strong analytical skills with DOE and data modeling experience.

Responsibilities

• Optimize semiconductor assembly processes through structured experiments and test planning.
• Lead cross-functional teams to enhance product performance and improve yield.
• Conduct statistical data analysis and Design of Experiments (DOE) for process improvements.

Skills

Analytical skills

Statistical data analysis

Design of Experiments (DOE)

Excellent communication

Presentation skills

Education

Master’s degree in Mechanical Engineering

Master’s degree in Material Science

Master’s degree in Physics

Tools

Wire bonders

Job description

Key Responsibilities:

• Optimize and characterize semiconductor assembly processes through structured experiments and test planning.
• Lead cross-functional teams to enhance product performance, improve yield, and ensure product robustness.
• Develop and implement new materials, technologies, and automation solutions for process advancements.
• Evaluate manufacturing processes to meet stringent customer requirements and establish standardized equipment operating procedures.
• Set up, calibrate, and fine-tune optical components and systems for proof-of-concept testing.
• Conduct statistical data analysis, modeling, and Design of Experiments (DOE) to drive process improvements.

Requirements:

• Min. Master’s degree in Mechanical Engineering, Material Science, Physics, or other relevant fields.
• Experience in automatic machine setup, optimization, and troubleshooting within high-volume precision manufacturing, assembly, or semiconductor industries.
• Familiarity with wire bonders or other semiconductor backend equipment is an advantage.
• Strong analytical skills with experience in statistical data analysis, DOE, and data modeling.
• Excellent communication and presentation skills to collaborate effectively with internal and external stakeholders.