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Process Engineer

PYXIS CF PTE. LTD.

Singapore

On-site

SGD 60,000 - 90,000

Full time

3 days ago
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Job summary

A leading semiconductor company in Singapore is looking for an experienced engineer to optimize assembly processes. The ideal candidate will have a Master’s degree in a relevant field and experience in high-volume precision manufacturing. Responsibilities include leading teams, developing new materials and technologies, and conducting data analysis to enhance product performance.

Qualifications

  • Minimum of Master's degree in a relevant engineering field.
  • Experience in high-volume precision manufacturing or semiconductor industries.
  • Excellent communication and collaboration skills.

Responsibilities

  • Optimize semiconductor assembly processes through structured experiments.
  • Lead teams to enhance product performance and improve yield.
  • Conduct statistical data analysis and drive process improvements.

Skills

Statistical data analysis
Data modeling
Communication skills
Analytical skills

Education

Master's degree in Mechanical Engineering, Material Science, Physics, or related fields

Tools

Wire bonders

Job description

Key Responsibilities:

  • Optimize and characterize semiconductor assembly processes through structured experiments and test planning.
  • Lead cross-functional teams to enhance product performance, improve yield, and ensure product robustness.
  • Develop and implement new materials, technologies, and automation solutions for process advancements.
  • Evaluate manufacturing processes to meet stringent customer requirements and establish standardized equipment operating procedures.
  • Set up, calibrate, and fine-tune optical components and systems for proof-of-concept testing.
  • Conduct statistical data analysis, modeling, and Design of Experiments (DOE) to drive process improvements.

Requirements:

  • Min. Master’s degree in Mechanical Engineering, Material Science, Physics, or other relevant fields.
  • Experience in automatic machine setup, optimization, and troubleshooting within high-volume precision manufacturing, assembly, or semiconductor industries.
  • Familiarity with wire bonders or other semiconductor backend equipment is an advantage.
  • Strong analytical skills with experience in statistical data analysis, DOE, and data modeling.
  • Excellent communication and presentation skills to collaborate effectively with internal and external stakeholders.
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