Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 85,000; Full time

Job summary

Une entreprise leader en technologies peut fournir une opportunité passionnante pour un Advanced Packaging Die Level Technology Engineer. Vous serez responsable du développement de processus d'assemblage avancés, de l'optimisation de la qualité des produits et de la collaboration avec des équipes multidisciplinaires pour soutenir l'innovation dans le domaine des semi-conducteurs.

Qualifications

• Minimum 2 ans d'expérience en développement de processus semi-conducteur.
• Compréhension des flux de processus et interactions.
• Capacité à travailler sous pression avec des ressources limitées.

Responsibilities

• Développer et optimiser des processus d'assemblage pour les technologies de packaging avancées.
• Travailler avec des parties prenantes internes et externes pour établir des stratégies de développement technologique.
• Assurer la transition vers la production de haute volume.

Skills

Process flows

Data analysis

Design of experiment techniques

Statistical Process Control

Defect analysis

Education

B.S/M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, or related fields

Job description

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include:

Process Development:

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Establish and improve process management projects to deliver technology node requirements

Equipment and Materials:

• Evaluate and promote new equipment and materials to enhance process capabilities
• Set up process parameters for a variety of semiconductor equipment
• Evaluate, promote, and plan for new equipment and materials

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes