Principal Engineer, Process Dev, Dry Etch

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading company in semiconductor technology is seeking a Plasma Etch Process Development Engineer. This critical role focuses on designing and optimizing plasma etch processes for cutting-edge DRAM and NVM products, requiring a PhD and extensive experience in dry etch development. Candidates will manage projects and collaborate to ensure robust processes meet stringent requirements, contributing significantly to product success.

Qualifications

• Over 7 years of relevant Dry Etch process development experience.
• Advanced understanding of plasma physics.
• Knowledge of dry etch processing principles.

Responsibilities

• Characterize and optimize plasma dry etch processes.
• Manage technical projects and collaborate with cross-functional teams.
• Develop recipes for structural requirements including HAR structures.

Skills

Data analysis techniques

Scripting

Troubleshooting

Experimental design

Process control

MS Office

Education

PhD in Engineering

PhD in Science

Job description

As a Plasma Etch Process Development Engineer in the Dry Etch Research and Development Group at Micron Technology, Inc., you will design and optimize plasma etch processes for Micron's leading edge DRAM and NAND/NVM Flash products. Your role involves taking ideas from conception through process development to implementation in our production facilities. You will also manage highly technical projects. This role is critical to Micron's product success and may require travel to manufacturing sites.

Primary responsibilities include plasma dry etch process characterization, optimization, design, troubleshooting, process transfer, and fundamental research. You will collaborate with process integration, electrical failure analysis, yield enhancement, manufacturing, and equipment vendors to ensure robust etch processes meeting physical and electrical requirements.

As a Principal Engineer – Dry Etch – NVM, travel for business purposes is required. Candidates should have an R&D aptitude, strong organizational skills, and the ability to work independently or in teams. Weekend support may be necessary for manufacturing line issues and monitoring program lots.

Your responsibilities will include, but are not limited to:

• R&D Pilot Line Fab activities, including updating engineers on customer issues and technology needs.
• Supporting root cause defect and fail mode analysis.
• Process development and integration to meet future product nodes.
• Developing recipes for structural and electrical requirements, including high aspect ratio (HAR) structures for NAND.
• Managing wafers through Dry Etch levels for special requirements.
• Working with cross-functional teams for NVM and CMOS structures.
• Supporting failure analysis and yield improvement efforts.
• Maintaining expertise in multiple process, hardware, or technology areas.
• Serving as a resource and mentoring peers in recipe and process development.

Qualifications include a PhD in Engineering or Science with over 7 years of relevant Dry Etch process development experience.

Successful candidates must have:

• Advanced understanding of plasma physics and sources used in plasma etching.
• Knowledge of dry etch processing principles.
• Understanding of topics like transport phenomena, electromagnetics, atomic/molecular physics, and surface phenomena.
• Knowledge of semiconductor processes.
• Preference for experience with data analysis techniques and scripting.
• Strong computer skills, including MS Office.
• Good troubleshooting, experimental design, and data analysis skills.
• Basic understanding of process control and SPC.
• Understanding of solid-state devices.