Principal Engineer, NAND Advanced Thin Films Process Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal Engineer in Process Development – Advance Thin Film to lead strategic development of structural and electrical film processes for NAND memory devices.

You will drive roadmaps, mentor teams, and ensure smooth transfer of new processes to manufacturing. The role demands a PhD or equivalent and 5–10 years in thin film R&D for NAND processes, with deep expertise in CVD, diffusion films, and advanced characterization.

Qualifications

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
• 5–10 years of Thin Film R&D experience for NAND processes, including CVD and diffusion thin films.

Responsibilities

• Define and implement the technical strategy for structural and electrical film process development for NAND devices.
• Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures.
• Oversee end-to-end development of process modules with manufacturability and scalability in mind.
• Resolve complex technical challenges with root-cause analysis and mitigation of failures.
• Mentor senior engineers and shape the technical direction across the organization.

Education

PhD or equivalent in Materials Science / Chemical Engineering / Physics / Chemistry / Electrical Engineering

Tools

XRR

Ellipsometry

SEM

TEM

SIMS

XPS

Gas delivery systems

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Position Overview

The Principal Engineer in Process Development –Advance Thin film plays a critical leadership role in the strategic advancement and implementation of sophisticated structural and electrical film processes for NAND memory technology. This position is responsible for defining technical direction, fostering innovation, and ensuring the successful integration of new processes into manufacturing. The Principal Engineer works collaboratively across multiple teams, contributes to the establishment of technology roadmaps, and delivers solutions that drive next-generation device scaling while supporting the organization’s objectives.

Key Responsibilities

• Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technology objectives.

• Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NAND structures and devices.

• Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration.

• Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures.

• Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation.

• Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects.

• Deliver solutions that enable and maintain a competitive leadership position in advanced memory technology, including benchmarking against industry standards.

• Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing.

• Identify and evaluate emerging trends, risks, and opportunities instructural and electric film technology, providing recommendations for future investments and critical initiatives.

• Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization.

Technical Expertise

• Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.

• In-depth knowledge of process-device and mechanical interactions, challenges associated with technology/device scaling, and the principles of reliability engineering for next-generation memory nodes.

• Proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems.

• Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).

• Strong foundation in thin film process development using plasma and thermal methods, especially for dielectric (including low K and high K films), carbon-based films, with an ability to analyze structural-process correlations and conduct failure analysis.

• Experience in benchmarking technology, conducting competitive analyses and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements.

• Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups.

• Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.

• Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment.

Qualifications

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.

• 5-10 years of experience in Thin Film research and development for NAND process, specifically including CVD and Diffusion Thin Films.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.