Principal Engineer - Fe Oct Cpee Hvm Dry Etch

Micron; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Micron Technology, Inc. seeks a Fab Engineer to lead and optimize Dry Etch processes, focusing on yield, quality, and cost improvements. You will work with a global team to resolve defects, drive process parameters, and implement CIP roadmaps for chamber upgrades and gas delivery systems.

The role emphasizes safety, sustainability, and the integration of AI-enabled insights to boost tool performance and process robustness across multiple Dry Etch fleets.

Qualifications

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or related field.
• Extensive experience in semiconductor equipment and process management in Dry Etch on multiple platforms.
• Proven track record maturing tool performance and establishing plasma process parameters for dry etch equipment.
• Experience in abnormal analysis (FDC, SPC excursions) and improvement with successful DRAM/NAND project work.
• Experience in plasma process and hardware improvement within the semiconductor industry, specifically in Dry Etch.
• Developing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers.

Responsibilities

• Strategize and lead productivity, yield, quality, and cost improvement across Dry Etch with global sites.
• Collaborate with cross-functional teams to reduce defects and improve CD uniformity across the fleet.
• Develop CIP roadmap for Dry Etch including chamber parts, gas delivery, and plasma source upgrades.
• Drive safety, cost efficiency, throughput, and sustainability in Dry Etch modules.
• Coordinate tool start-up acceptance criteria, chamber qualification flows, and service requirements with suppliers.

Skills

Dry Etch

Process development

FMEA

SPC

AI-assisted tools

Education

Bachelor's or Master's in Engineering

Tools

LAM Kiyo

Flex

Vantex

Versys

TEL Tactras

AMAT Sym3

Centura

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Fab Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. This position will identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

• Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification , and CIP development collaboration with dry etch suppliers.
• Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet.
• Develop the process and hardware CIP roadmap for Dry Etch - covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades.
• Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules ( Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.).
• Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements ; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure).
• Improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions .
• Set up IoT/FDC sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools and develop new solutions for excursion prevention and chamber-health monitoring .
• Establish and improve process windows and recipe robustness , upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs (consumable lifetime extension, gas usage optimization).
• Enable new solutions for energy savings (RF power optimization, eco-mode), PFC/F-gas abatement, and waste reduction aligned to Micron's sustainability targets.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Requirements

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science , or a related field, or equivalent experience.
• Extensive experience in semiconductor equipment and process management in Dry Etch (LAM Kiyo / Flex / Vantex / Versys, TEL Tactras / RK, AMAT Sym3 / Centura, or equivalent platforms).
• Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
• Experience in abnormal analysis (FDC, SPC excursions, chamber-matching deviations) and improvement, with a solid history of successful project implementation across DRAM and/or NAND flows.
• Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch .
• Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
• Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
• Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
• Ability to strictly adhere to safety, quality, and sustainability st