PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

GlobalFoundries; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A global semiconductor foundry is seeking an experienced 3D Heterogeneous Integration Engineer in Singapore to lead innovative development in multi-layer stacking for hybrid bonding processes. The ideal candidate will have a Master’s or PhD in relevant fields with extensive experience in R&D and project management. Responsibilities include process development, cross-team collaboration, and continuous improvement of production technologies, ensuring high standards of safety and efficiency in this advanced packaging technology role.

Qualifications

• Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field.
• Experience of at least 12 years is required.
• Strong management, communication, and planning skills.

Responsibilities

• Lead 3DHI process development efforts for next-generation multi-layer stacking.
• Drive end-to-end process integration and planning for product development.
• Collaborate with vendors for developing new processes and technologies.

Skills

Project management

Leadership

Communication

Planning & organization

Education

Master’s in Electrical Engineering

PhD in related field (preferred)

Job description

PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development) page is loaded

PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

Apply locations Singapore time type Full time posted on Posted 3 Days Ago job requisition id JR-2501631

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Summary of Role:

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive next-generation multi-layer stacking for hybrid bonding development.

Essential Responsibilities:

• Lead 3DHI process development efforts for the building blocks required for advanced packaging solution s needed in the product lines (e.g. , multi-die stacking, fine pitch hybrid bond ing , etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.

• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.

• Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.

• Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D HI processes.

• Drive understanding of failure modes.

• Facilitate a dvanced p ackaging interactions between the GF Singapore Product Line/Fab teams and customers.

• Generate IP related to novel wafer integration & packaging technology.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Take part in hiring of other Advanced Packaging team members in Singapore.

• Mentor and guide new hires to assume their roles and responsibilities.

• Other duties as assigned by manager.

Required Qualifications:

• Education – Master’s in Electrical Engineering , Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.

• MS degree with at least 1 2 years of prior related work experience.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Language Fluency - English (Written & Verbal).

• Travel - Up to 20%.

Preferred Qualifications:

• Education – PhD education level preferred with at least 10 years of prior related work experience.

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.

• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.

• Strong written and verbal communication skills .

• Strong planning & organizational skills.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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At GlobalFoundries you will find a vibrant work environment where collaboration and innovation thrive. Our diverse and global team shares a culture of respect and inclusivity, representing the best in the industry. We celebrate success together and are united by our dedication to excellence and our desire to improve and empower the world.