NTI NAND Senior/Principal Process Integration Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A global leader in semiconductor innovation is seeking a Senior/Principal NAND Module Process Integration Engineer in Singapore. This role involves leading the development of innovative solutions for 3D NAND products, optimizing process performance, and resolving technical challenges. Candidates should have a background in Electrical Engineering or related fields and experience in the semiconductor industry. Strong analytical skills and ability to work in cross-functional teams are critical.

Qualifications

• Passionate about semiconductor technology and innovation.
• Ability to develop strong end-to-end understanding of PI modules.
• Committed to quality, collaboration, and continuous improvement.

Responsibilities

• Lead and improve next-generation 3D NAND Product Yield.
• Define specifications and process requirements for modules.
• Solve structural and electrical issues proactively.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication skills

Cross-functional teamwork

Education

BS, MS/PhD in Electrical Engineering

Microelectronics

Chemical Engineering

Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and execute device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Cross-Functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across cross-functional teams to enable a project to proceed in a rapid and low error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on-job training and training class.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.

Preferred to have Skills / Experiences as below:

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the Process Areas or Process Integration.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field