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NPI Engineer - Test Process (WLCSP)

ASE Singapore Pte Ltd

Singapore

On-site

SGD 60,000 - 80,000

Full time

30+ days ago

Job summary

A leading company in the semiconductor industry is seeking a Process Engineer to handle qualifications, optimize device performance, and lead continuous improvement programs. The ideal candidate will have an engineering degree/diploma and can communicate effectively with various stakeholders. Entry-level engineers are encouraged to apply.

Qualifications

  • Engineering degree or diploma required.
  • Experience in semiconductor processes is an advantage.
  • Entry-level candidates welcome.

Responsibilities

  • Monitor device yield performance and process SPC charts.
  • Investigate production downtime and quality issues.
  • Implement continuous improvement programs.

Skills

Knowledge in SPC
Knowledge in FMEA
Multi-tasking
Communication

Education

Diploma / Degree in Engineering Discipline

Tools

SPC
DOE
Control Plan

Job description

Job Description

  • Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
  • Monitor and improve device yield performance and process SPC charts.
  • Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots.
  • Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
  • Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
  • Facilitate training of manufacturing personnel on operating procedures and process specification.
  • Work closely with inter-department to improve process and equipment performance and capability.
  • Coordinate and communicate with customers for any process engineering related matters.
  • Setup systems and NPI requirements, handles qualifications and engineering activities.

Requirements

  • Diploma / Degree in any Engineering Discipline
  • Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage.
  • Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
  • Clear and effective communication with customers, suppliers and cross department
  • Able to multi-task and support ad-hoc projects in process and equipment related activities
  • Entry level candidates are welcome to apply
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