NAND CMOS Reliability Intern: Data Analytics & AI Focus

Micron; Singapore; On-site; SGD 13,000 - 20,000; Full time

Job summary

Micron Technology, Inc. in Singapore is offering an internship in the Process Integration Engineering (PIE) team focused on NAND CMOS metallisation concepts and reliability study methodologies.

The role provides structured exposure to data analytics and AI/ML platforms used to study failure trends and enhance reliability within semiconductor manufacturing. The intern will learn to use Micron‑customised analytics tools and dashboards while observing cross‑functional collaboration.

Qualifications

• Basic understanding of semiconductor fabrication processes (preferred).
• Interest in data analysis, reliability studies, or process learning.
• Willingness to learn and collaborate in a team environment.
• Course of Interest Engineering and Science (all relevant disciplines).

Responsibilities

• Gain exposure to advanced NAND CMOS metallisation concepts and their relationship to device reliability.
• Learn how data analytics and AI/ML platforms are used to study failure trends and support reliability learning.
• Observe cross‑functional collaboration within Process Integration and related engineering teams.
• Deliver learning documentation summarising reliability fail mechanisms studied and observations from guided analysis.

Skills

Semiconductor fabrication basics

Data analysis interest

Willingness to learn

Engineering and science focus

Education

Course of Interest Engineering and Science (all relevant disciplines)

Job description

Micron Technology, Inc. in Singapore is offering an internship in the Process Integration Engineering (PIE) team focused on NAND CMOS metallisation concepts and reliability study methodologies.

The role provides structured exposure to data analytics and AI/ML platforms used to study failure trends and enhance reliability within semiconductor manufacturing. The intern will learn to use Micron‑customised analytics tools and dashboards while observing cross‑functional collaboration.