Member of Technical Staff/ Engineer, QA (Process Quality Control)

Silicon Box Pte. Ltd.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A leading company in the semiconductor manufacturing sector is looking for a Member of Technical Staff (MTS)/ Engineer, QA to develop and deploy inspection procedures ensuring material conformance. The role involves leading engineering teams, data analysis, and driving quality improvements in a fast-paced environment, ideal for candidates with a solid background in semiconductor processes.

Qualifications

• Minimum 5 years of relevant experience in backend semiconductor packaging processes.
• Strong foundation in process engineering and quality control.
• Proficient in SPC and data analysis tools.

Responsibilities

• Lead PQC engineers in yield and product gating checks.
• Responsible for backend semiconductor packaging processes.
• Develop and enhance procedures related to backend PQC processes.

Skills

Process engineering

Yield improvement

Quality control

Data analysis

Statistical process control (SPC)

Collaboration

Education

Bachelor’s Degree in Engineering

Tools

FMEA

Control Plans

Job description

Position Summary

The Member of Technical Staff (MTS)/ Engineer, QA (Process Quality Control) is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Responsibilities

• Lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement.

• Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.

• Develop or enhance procedures and work instructions related to backend PQC processes.

• Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.

• Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making.

• Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.

• Identify chronic process and quality issues and implement permanent corrective actions.

• Responsible for new product process development and supporting smooth pilot-to-high volume transitions.

• Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.

• Ensure the relevance and accuracy of Work Instructions, Control Plans, FMEA, and other process control documents.

• Ensure audit readiness for internal and external audits and manage timely closure of findings.

• Any other ad-hoc duties as assigned.

Requirements

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).

• Minimum 5 years of relevant experience in backend semiconductor packaging processes.

• Strong foundation in process engineering, yield improvement, and quality control.

• Proficient in SPC and data analysis tools.

• Familiarity with FMEA, Control Plans, and OSAT backend processes.

• Hands-on experience with new product and process evaluations.

• Effective communicator; capable of presenting data and driving cross-team collaboration.

• Able to thrive in a fast-paced, high-volume manufacturing environment.

We regret that only shortlisted candidates will be notified.