Mechanical Engineer (Listed Global Technology Solutions Provider)

LICO RESOURCES PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading technology solutions provider in Singapore is looking for a Mechanical Design Engineer to join their team. In this role, you will develop precision modules for advanced packaging applications, ensuring compliance with safety and quality standards. The ideal candidate should have a bachelor's degree in Mechanical Engineering and proven mechanical design experience, particularly in the semiconductor sector. Proficiency in 3D CAD tools is essential. Interested candidates should email their resumes to apply.

Qualifications

• Proven experience in mechanical design, ideally within the semiconductor or precision equipment domain.
• Strong grasp of mechanical fundamentals, including stress analysis, thermal behavior, and motion precision.

Responsibilities

• Translate application and performance requirements into robust mechanical design concepts.
• Conduct force analysis, vibration modeling, thermal simulations, and lifespan estimations.
• Develop and compare multiple design options balancing performance and cost-efficiency.
• Select appropriate materials for reliability standards compatible with cleanroom manufacturing.
• Design high-precision jigs, fixtures, and custom tooling for advanced microelectronic assembly.

Skills

Mechanical design

3D CAD tools

Problem-solving skills

Collaboration skills

Education

Bachelor’s degree or higher in Mechanical Engineering

Tools

Solid Edge

SolidWorks

Pro-E

AutoCAD

Job description

Lico Resources is partnering with a prominent technology solutions provider renowned for its contributions to the global semiconductor manufacturing sector. This organization is recognized for its cutting-edge innovations in high-precision engineering and advanced packaging systems.

Mechanical Design Engineer – High-Precision Equipment Design

We are seeking a talented mechanical design professional to join a multidisciplinary team responsible for developing precision modules used in advanced packaging applications. This Singapore-based role offers the chance to influence critical aspects of semiconductor equipment design, from concept through to production, within a fast-paced and innovation-driven environment.

Key Responsibilities

• Translate application and performance requirements into robust mechanical design concepts and detailed specifications.
• Conduct force analysis, vibration modeling, thermal simulations, and lifespan estimations to evaluate and optimize design integrity.
• Develop and compare multiple design options, balancing performance, cost-efficiency, and manufacturability.
• Select appropriate materials that meet reliability standards and are compatible with cleanroom manufacturing and semiconductor processes.
• Design high-precision jigs, fixtures, and custom tooling to support advanced microelectronic assembly.
• Create detailed 3D models and perform structural assessments using simulation tools.
• Work in close coordination with process, manufacturing, and test engineering teams to ensure smooth design transfer and manufacturability.
• Drive continuous improvement initiatives by identifying opportunities to enhance product performance, design efficiency, and cost control.
• Adhere to safety, quality, and environmental compliance standards in line with regulatory requirements in Singapore.

Qualifications

Essential:

• Bachelor’s degree or higher in Mechanical Engineering or a closely related discipline.
• Proven experience in mechanical design, ideally within the semiconductor or precision equipment domain.
• Proficient in 3D CAD tools such as Solid Edge, SolidWorks, Pro-E, or AutoCAD.
• Strong grasp of mechanical fundamentals, including stress analysis, thermal behavior, and motion precision.
• Effective problem-solving skills and the ability to manage multiple design iterations in a dynamic environment.

Desirable:

• Familiarity with advanced packaging processes such as wafer-level packaging, 2.5D/3D integration, or flip-chip assembly.
• Exposure to thermal management strategies, vibration damping, or high-precision motion control systems.
• Strong communication and collaboration skills for cross-functional teamwork and technical presentations.

If you are interested in this role, please send us your updated resume today to [e-mail] quoting reference number A088451. Please note that only shortlisted candidates will be notified.

"Data provided is for recruitment purposes only."

Job Reference No: A088451
EA Licence No.: 13C6733
EA Registration No.: R1333454