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A leading company in the semiconductor industry seeks a Senior Mechanical Design Engineer to contribute to high-precision designs for advanced packaging applications. In this role, you will engage in innovative engineering work, ensuring designs meet stringent safety and quality standards, while collaborating with various teams to optimize design performance and manufacturability.
Location: North-east
AWS & VB provided
We are looking for a passionate and skilled Senior Mechanical Design Engineer to join our team and contribute to the development of high-precision mechanical modules for advanced packaging applications in the semiconductor industry. In this role, you’ll transform innovative concepts into robust designs that support cutting-edge semiconductor manufacturing processes like wafer-level packaging, 2.5D/3D integration, and flip-chip assembly.
This is an exciting opportunity to work at the forefront of engineering innovation, collaborating with cross-functional teams to deliver solutions that are accurate, efficient, and production-ready.
Translate customer and system requirements into robust mechanical design specifications.
Generate, validate, and optimize design concepts using force analysis, thermal/vibration simulation, and lifetime estimation.
Design high-precision tooling, modules, and fixtures that meet stringent tolerances and packaging requirements.
Perform 3D modeling, structural analysis, and prepare engineering drawings and BOMs.
Work closely with process, manufacturing, and quality teams to ensure design feasibility and smooth integration (DFM/DFA).
Select appropriate materials for durability, cost-efficiency, and compatibility with cleanroom and semiconductor processes.
Drive continuous improvement in design performance, reliability, and manufacturability.
Ensure all designs comply with safety, quality, and environmental standards under local regulations.
Degree or higher in Mechanical Engineering, Mechatronics, or related fields.
Experience in mechanical design, preferably for semiconductor or precision automation equipment.
Proficient in CAD and simulation tools: Solid Edge, SolidWorks, Pro-E, AutoCAD.
Understanding of advanced packaging technologies (wafer-level, 2.5D/3D, flip-chip) is a strong advantage.
Familiarity with thermal management, vibration control, and motion systems is preferred.
Strong problem-solving mindset, attention to detail, and ability to thrive in a dynamic, fast-paced environment.
To Apply, kindly click on the "APPLY NOW" button.
We regret that only shortlisted candidates will be notified.
Staffking Pte Ltd (20C0358) | Chong Kar Ming (John) (R21101412)