Materials Engineer

Apple Inc.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading technology company is seeking a materials engineer specializing in adhesive materials for semiconductor packaging. The role involves selecting and characterizing materials crucial for module assembly, requiring deep knowledge in various characterization techniques. Ideal candidates will have a degree in Materials or Chemical Engineering and extensive industry experience.

Qualifications

• More than 3 years’ experience in characterization methodologies.
• Experience/knowledge on adhesive material formulation is preferable.

Responsibilities

• Drive material selection for semiconductor packaging.
• Characterize new materials and engage in feedback during characterization.

Skills

DMA characterization

TMA characterization

DSC characterization

Rheometer characterization

TGA characterization

Education

Degree in Materials/Chemical Engineering

Job description

We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation.Excellent opportunity to be involved in material development, you will be responsible for select selection, characterization and optimization of adhesive and interconnect materials for electrical and optical modules and packaging.

Description

You will drive material selection for semiconductor packaging and module assembly, in particular adhesives for mechanical and electrical interconnect purposes. Perform new material characterization and understand material applications and feedback findings or issues encountered during characterization.

Minimum Qualifications

• Degree of Materials/Chemical Engineering
• More than 3 years’ experience in DMA/TMA/DSC/Rheometer/TGA characterisation

Preferred Qualifications

• Experience/knowledge on adhesive material formulation
• Experience on GCMS
• Material level characterization methodology development (how to correlate with module performance)