Lithography Process Engineer (Manager / Senior Engineer)

Reeracoen Singapore Pte Ltd; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading advanced packaging solutions provider in Singapore is seeking an experienced Lithography Process Engineer to lead the development and optimization of processes for advanced packaging. The role demands a PhD or Master’s degree, along with 5-10+ years of experience and strong analytical skills. Responsibilities include process improvement and collaboration with cross-functional teams. Competitive salary and benefits are offered.

Benefits

AWS

Variable Bonus

16 days Annual Leave

Medical Leave

Family care leave

Dental care

Company phone provided

Qualifications

• 5–10+ years of experience in lithography development.
• Familiarity with process integration for advanced packaging.

Responsibilities

• Lead lithography development for advanced packaging.
• Improve processes for cost reduction.
• Collaborate with teams to support new product introductions.

Skills

Lithography development

Defect analysis

Process optimization

Data analysis

Cross-functional collaboration

Problem-solving

Education

PhD or Master’s degree in relevant field

Tools

Optical inspection

SEM

AI/ML tools

Job description

Job title: Lithography Process Engineer (Manager / Senior Engineer) Reference ID: 36945

Salary Range: 8,000 - 14,000 SGD

Our client is launching a new business and establishing a new factory in Singapore. They are seeking an experienced Lithography Process Engineer to join their team and contribute to advanced packaging solutions.

Responsibilities

• 1. Process Development & Optimization
     • Own lithography development for advanced packaging solutions.
     • Develop manufacturable, repeatable, and high‑yielding processes.
     • Improve processes for cost reduction, cycle time reduction, and yield enhancement.
     • Collaborate with cross‑functional teams to lead innovations in lithography and implement solutions.
     • Drive industry‑leading lithography solutions for panel lithography.
  2. Equipment & Tooling Support
     • Participate in defining lithography equipment specifications and validating tools.
     • Work with cross‑functional teams to monitor and maintain tool performance.
  3. Yield & Quality Improvement
     • Implement and refine process monitoring techniques and defect inspection to proactively resolve lithography defects.
     • Collaborate with upstream and downstream process owners (e.g., plating, deposition, etching) to ensure seamless integration.
     • Support the development of process flows for advanced packaging substrates.
  4. Data Analysis & Documentation
     • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
     • Document standard operating procedures (SOPs), work instructions, and control plans.
  5. Cross‑Functional Collaboration
     • Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale‑up and new product introduction (NPI).
     • Assist with customer qualifications and reliability testing as needed.
     • Contribute to product risk management discussions, leveraging expertise to influence decisions.
  6. Perform other ad‑hoc duties as assigned to support the team and organizational goals.

What you will receive

• AWS
• Variable Bonus (based on company and individual performance)
• Annual Leave: 16 days (up to a maximum of 20 days)
• Medical Leave
• Family care leave (2 days/year)
• Dental care
• Company phone will be provided

Requirements & Preferences

• (Must)
  • PhD or Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
  • 5–10+ years of experience in lithography development.
  • Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
  • Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
  • Strong analytical, documentation, and problem‑solving skills.
  • Good communication and teamwork in a cross‑functional environment.
  • Familiarity with metrology tools for thin film and etch characterization (e.g., XRF, 4PP, ellipsometry, profilometer).
  • Ability to support lithography‑related metrology such as CD‑SEM, Film metrics, Inspection, and Defect Review, including creating recipes and running wafers independently.
  • Experience using AI/ML to enhance process discovery.