Lead Process Engineer - CPO & Testing

Taurus Firm Pte Ltd; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

A leading technology company is seeking a Lead Process Engineer to contribute to advanced packaging R&D for Co-Packaged Optics (CPO). The successful candidate will engage in hands-on process development, focusing on machine optimization and tool design while collaborating with global teams to enhance yield improvements in Fiber Array Unit (FAU) attachment.

Qualifications

• ≥5 years experience in semiconductor assembly processes.
• Strong knowledge in flip-chip, wirebond, die attach.
• Familiarity with epoxy materials and optical alignment.

Responsibilities

• Lead FAU attach process development and machine optimization.
• Perform root-cause analysis and yield improvement.
• Design tools, fixtures, and test jigs for optical assemblies.

Skills

Analytical skills

Hands-on skills

Cross-functional collaboration

Education

Degree/Master/PhD in Electrical/Electronics Engineering

Tools

3D printing

Job description

Lead Process Engineer - CPO & Testing

Overview:

Contribute to advanced packaging R&D for Co-Packaged Optics (CPO), collaborating with global teams. The role involves hands-on process development, optical alignment, tooling design, and machine optimization to drive yield improvements and technical innovation in Fiber Array Unit (FAU) attachment.

Key Responsibilities:

• Lead FAU attach process development (passive/active alignment, epoxy dispensing, bonding, curing)
• Operate and maintain sub-micron active alignment machines
• Perform root-cause analysis, yield improvement, and data collection
• Design new pickup tools, fixtures, and test jigs for optical assemblies
• Work with vendors to enhance machine performance for CPO projects
• Draft FMEA, process control specs, and coupling loss test procedures

Requirements:

• Degree/Master/PhD's in Electrical/Electronics Engineering
• ≥5 years experience in semiconductor assembly processes
• Strong knowledge in flip-chip, wirebond, die attach, FAU-to-PIC coupling
• Familiarity with epoxy materials, optical alignment, and bonding techniques
• Advantage: 3D printing experience of polymer/resin-material
• Strong analytical, hands-on, and cross-functional collaboration skills