Lead Electrical Failure Analysis Engineer - NAND

micron; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an experienced Electrical Failure Analysis Engineer to diagnose yield-limiting failures in next-generation NAND devices.

You will combine bench testing, probe data analysis and physical failure analysis to pinpoint failure mechanisms and deliver actionable insights guiding development. Lead FA characterization, fault isolation, and de-processing; apply data analytics to large datasets; present findings to cross-functional teams and drive yield

Qualifications

• MS or PhD in a relevant engineering science.
• Proven semiconductor FA experience (Failure Analysis, Yield).
• Deep knowledge of NAND/NOR memory technologies.
• Strong data analytics and ability to communicate findings.

Responsibilities

• Lead electrical failure analysis, including fault isolation and de-processing of semiconductor devices.
• Drive root-cause analysis by correlating electrical, inline, parametric, probe, and fab data.
• Develop new FA methodologies to improve detection and turnaround time.
• Apply analytics to large semiconductor datasets to identify failure signatures and trends.
• Deliver FA reports and visualizations to technical and executive audiences.
• Collaborate with Process Integration, Yield Enhancement, Metrology, RDA, and Data Science teams to improve yield.
• Support technology transfer from R&D to manufacturing.
• Present results in global forums with product development and manufacturing teams.

Skills

Failure analysis

Process integration

Yield enhancement

NAND/NOR knowledge

Semiconductor process flow

Data analysis

Analytical communication

Education

MS in Electrical Engineering / Microelectronics / Materials Science / Chemical Engineering / Physics or related field

PhD considered a plus

Tools

SEM

FIB

TEM

EDS

EELS

Job description

Micron Technology, Inc. in Singapore is seeking an experienced Electrical Failure Analysis Engineer to diagnose yield-limiting failures in next-generation NAND devices.

You will combine bench testing, probe data analysis and physical failure analysis to pinpoint failure mechanisms and deliver actionable insights guiding development. Lead FA characterization, fault isolation, and de-processing; apply data analytics to large datasets; present findings to cross-functional teams and drive yield