Intern - Package Development Engineering

Micron Technology; Singapore; In loco; SGD 20.000 - 27.000; Part-time

Descrizione del lavoro

Micron Technology, Inc. invites motivated undergraduates and graduates to join the Package Development Engineering team for a 3-month internship in Singapore.

You will collaborate with PDE leadership and engineers on packaging, analytics, automation, and AI-enabled workflows, gaining hands-on experience from problem definition to final recommendations. You will work with Excel, Python and Power BI to collect, analyze and visualize data, and contribute to engineering productivity improvements and

Competenze

• Strong analytical and problem-solving skills required.
• Comfortable working with engineering data.
• Familiarity with Excel, Python, Power BI or similar tools preferred.
• Interest in semiconductor technology, AI, data analytics or related fields.

Mansioni

• Assist PDE team with package development engineering tasks.
• Analyze data to identify trends, issues and opportunities for improvement.
• Develop dashboards, automation or analytics tools to boost productivity.
• Document findings and present recommendations to PDE leadership.

Conoscenze

Analytical thinking

Problem solving

Engineering data handling

Communication

Formazione

Bachelor's or Master's in Engineering or Computer Science

Strumenti

Excel

Python

Power BI

Descrizione del lavoro

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Project Title

Package Development Engineering Internship: Advanced Packaging, Engineering Analytics & AI Enablement

Project Description

The intern will join the Package Development Engineering (PDE) team for a 3-month assignment, working with PDE leadership and engineers on a focused engineering project related to semiconductor packaging, process development, engineering analytics, automation, and productivity improvement.

The internship provides hands‑on exposure to how advanced semiconductor packages are developed, characterized, improved, and prepared for manufacturing.

Project Scope

• Package and process development, including engineering data collection, analysis, and documentation.
• Engineering data analysis to identify trends, issues, and improvement opportunities.
• Experiments, evaluations, package/process characterization, and development activities.
• Yield, quality, cost, and cycle‑time improvement.
• Development of dashboards, automation, or analytical tools to improve engineering productivity and decision‑making.
• Application of AI, data analytics, and automation to engineering workflows.
• Cross‑functional problem‑solving with engineering teams on package development challenges.

Learning Opportunities

• Practical exposure to semiconductor package development and manufacturing.
• Experience working with real engineering problems, datasets, and development activities.
• Exposure to advanced packaging, yield improvement, engineering analytics, automation, and AI‑enabled engineering.
• Opportunity to work with experienced engineers and technical leaders.
• Experience taking a project through the full cycle of problem definition -> analysis -> solution -> recommendation.
• Exposure to technical communication and presenting engineering findings to PDE leadership.

Deliverables

• Complete a focused engineering project with measurable outcomes.
• Develop the relevant engineering analysis, model, dashboard, automation, or technical recommendation.
• Document key findings, methodology, and recommendations.
• Prepare a concise technical summary.
• Present the final project, results, and learnings to the PDE team/leadership.

Impact of Project

• Improving engineering productivity and decision‑making.
• Accelerating engineering data analysis and problem‑solving.
• Identifying opportunities to improve yield, quality, cost, or cycle time.
• Improving engineering workflows through analytics, automation, or AI.
• Generating insights or solutions that can potentially be extended to future package‑development activities.

Skillsets Required

• Strong analytical and problem‑solving skills.
• Comfortable working with engineering data.
• Familiarity with Excel, Python, Power BI, or similar analytical tools is preferred.
• Interest in semiconductor technology, advanced packaging, manufacturing, AI, or data analytics.
• Curious, self‑driven, and willing to learn in a fast‑paced engineering environment.
• Good communication skills and ability to work across technical disciplines.

Course of Interest

Students currently pursuing a Bachelor's or Master's degree in:

• Electrical / Electronic Engineering
• Mechanical Engineering
• Materials Science / Materials Engineering
• Chemical Engineering
• Data Science / Data Analytics
• Computer Engineering / Computer Science
• Manufacturing / Industrial Engineering
• Other related technical or engineering disciplines

Duration

3 months

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high‑performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labour and complies with all applicable laws, rules, regulations, and other international and industry labour standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.