[Global OSAT] Wet Process Engineer

We are seeking an experienced Wet Process Engineer to join a dynamic semiconductor manufacturing team. The role focuses on sustaining wet process operations and supporting new product introduction through process development and optimization. The ideal candidate will have a solid background in wet processes such as electroplating or etching, preferably within a bumping or wafer fab environment, and a strong passion for continuous improvement and operational excellence.

Key Responsibilities

1. Manage and sustain daily operations for wet process tools and recipes, ensuring stable production performance.
2. Develop, evaluate, and implement wet process flows based on product and customer requirements.
3. Conduct process window studies and implement improvements to enhance CPK and minimize out-of-control (OOC) occurrences.
4. Support new product introduction (NPI), including process gap analysis and safe launch monitoring.
5. Lead device qualifications and process enhancement initiatives using the APQP methodology.
6. Collaborate with the Quality team to resolve customer issues and ensure timely feedback and resolution.
7. Execute cost and yield improvement projects under the Continuous Improvement Program (CIP).
8. Monitor process stability through Statistical Process Control (SPC) and maintain robust control systems.
9. Qualify new materials, chemicals, and equipment within timeline and specification targets.
10. Partner with R&D teams to evaluate new technologies and contribute to roadmap initiatives.
11. Ensure all documentation (work instructions, pFMEA, OCAP) is updated and compliant with TS16949 standards.
12. Participate in smart manufacturing initiatives, including AI-based inspection, automation, and traceability systems.

Requirements

1. Bachelor's degree in Engineering or Science (e.g., Chemical, Materials, Electrical, or related discipline).
2. At least 3 years of experience in semiconductor manufacturing, particularly in wet process areas like electrochemical plating or wet etching.
3. Strong foundation in SPC, process control, and statistical analysis.
4. Familiarity with quality tools such as FMEA, DOE, and OCAP.
5. Experience in bumping or wafer fab environments is highly preferred.

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg