Failure Analysis (FA) Engineer - JY

PASONA SINGAPORE PTE. LTD.; Singapore; Presencial; SGD 61.000 - 73.000; Jornada completa

Descripción de la vacante

PASONA SINGAPORE PTE. LTD. is seeking a Failure Analysis & Root Cause Investigation specialist to conduct analyses on media defects affecting yield and reliability.

You will perform systematic root cause investigations, correlate defect characteristics with media processes, and work closely with Process, Evaluation, Manufacturing, and Quality teams. The role requires a Bachelor's degree in a related field and a minimum of 4 years in FA or materials characterization, with hands-on experience

Formación

• Bachelor's degree or above in relevant disciplines.
• Minimum 4 years in Failure Analysis or related fields.
• Experience supporting manufacturing or quality issues.
• Experience with independent root cause investigations.

Responsabilidades

• Conduct FA on media defects affecting yield and reliability.
• Perform root cause investigations on qualification failures and RTV.
• Collaborate with Process, Evaluation, Manufacturing, and Quality teams.
• Prepare technical reports and present findings.
• Maintain FA databases and support lab operations.

Conocimientos

Root cause analysis

Problem solving

Data interpretation

Statistical analysis

Educación

Bachelor's degree in Materials Science/Physics/Chemistry/EE/ME

Herramientas

SEM/EDX

AFM

Candela OSA

FIB

Zygo Optical Profilers

Descripción del empleo

Job ID: 20436

• Location: West (Company transport provided)
• Working hours: 8.30am - 5.30pm
• Salary: up to $6,000 (Depending on experiences)

Job Description

Failure Analysis & Root Cause Investigation:

• Conduct failure analysis on media defects affecting product yield, reliability, and customer quality.
• Perform systematic root cause investigations on qualification failures, manufacturing excursions, and customer returns (RTV).
• Correlate defect characteristics with media processes and HDD performance.

Analytical Characterization:

• Perform hands-on analysis using various characterization tools and techniques.
• Interpret physical, chemical, and surface-related defects to determine failure mechanisms.
• Develop and execute appropriate FA methodologies based on investigation needs.

Cross-Functional Collaboration:

• Work closely with Process, Evaluation, Manufacturing, and Quality teams to identify corrective and preventive actions.
• Support new product qualification and technology development activities through defect characterization and risk assessment.
• Present investigation results and recommendations to technical teams and management.

Reporting & Continuous Improvement:

• Prepare technical reports summarizing findings, root causes, and improvement actions.
• Maintain failure analysis databases and contribute to best-practice development.
• Support laboratory operation, equipment qualification, and continuous improvement initiatives

Job Requirement

Qualification

• Bachelor's Degree or above in Materials Science, Physics, Chemistry, Electrical Engineering, Mechanical Engineering, or related disciplines

Experience

• Minimum 4 years of experience in Failure Analysis, Materials Characterization, Semiconductor, Data Storage, HDD, or related industries.
• Proven track record in conducting independent root cause investigations.
• Experience supporting manufacturing, R&D, or customer quality issues.

Technical Requirement

• Hands-on experience with several of the following analytical tools: SEM/EDX, AFM, Candela OSA, FIB, Zygo Optical Profilers.

Technical Competencies

• Strong root cause analysis and problem-solving skills.
• Ability to interpret complex analytical data and translate findings into actionable recommendations.
• Knowledge of thin-film materials, surface characterization, and defect analysis methodologies.
• Experience with statistical data analysis and reporting tools is an advantage.

Preferred

• Experience in HDD media, magnetic recording, semiconductor, or advanced materials industries.
• Familiarity with media manufacturing processes, surface defects, contamination analysis, and reliability-related failure mechanisms