Engineer - Test Process (WLCSP)

ASE Global; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading semiconductor company is looking for a Process Engineer in Singapore to optimize device qualification and engineering processes. Responsibilities include monitoring performance, troubleshooting quality issues, and facilitating training. Candidates with an engineering diploma and relevant manufacturing experience are encouraged to apply. This position welcomes entry-level candidates.

Qualifications

• Experience in semiconductor assembly manufacturing or process engineering is a plus.
• Entry level candidates are welcome to apply.

Responsibilities

• Optimize new device qualification and engineering lot processing.
• Monitor device yield performance and process SPC charts.
• Investigate production downtime and quality issues.

Skills

Knowledge in SPC

Effective communication

Multi-tasking abilities

Education

Diploma / Degree in any Engineering Discipline

Tools

FMEA

Control Plan

Job description

Responsibilities:

• Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
• Monitor and improve device yield performance and process SPC charts.
• Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots.
• Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
• Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
• Facilitate training of manufacturing personnel on operating procedures and process specification.
• Work closely with inter-department to improve process and equipment performance and capability.
• Coordinate and communicate with customers for any process engineering related matters.
• Setup systems and NPI requirements, handles qualifications and engineering activities.

Requirements:

• Diploma / Degree in any Engineering Discipline
• Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage.
• Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
• Clear and effective communication with customers, suppliers and cross department
• Able to multi-task and support ad-hoc projects in process and equipment related activities
• Entry level candidates are welcome to apply