Engineer, New Product Introduction - IC Packaging

CONTINENTAL AUTOMOTIVE SINGAPORE PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading company in automotive solutions seeks a professional to lead the New Product Introduction (NPI) process for PMIC products. In this role, you will manage the transition from concept to mass production, ensure product quality and manufacturability while collaborating with cross-functional teams. Your expertise in semiconductor processes and project management, along with strong problem-solving abilities, will be crucial to drive project success.

Qualifications

• Minimum five years’ experience in semiconductor processes or management.
• Strong technical proficiency in package and assembly processes.
• Good knowledge of semiconductor manufacturing and electronic testing.

Responsibilities

• Lead NPI process from Concept to Mass Production at OSAT.
• Identify opportunities for cost reduction in packaging materials.
• Prepare and present reports on NPI project status and risks.

Skills

Problem-solving

Communication

Team player

Education

Degree in Electronics/Electrical Engineering

Job description

Job Description

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

Qualifications

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.