Engineer, New Product Introduction - IC Packaging

CONTINENTAL AUTOMOTIVE SINGAPORE PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

A leading technology company in automotive electronics is seeking a qualified professional to lead the NPI process from concept to mass production of semiconductor products. The ideal candidate will have a strong background in electronics engineering, with at least five years of relevant experience in semiconductor manufacturing and excellent problem-solving skills. This role offers the opportunity to interface with key stakeholders and drive product quality and manufacturability in a dynamic environment.

Qualifications

• Minimum five years’ experience in semiconductor or subcon management is required.
• Good knowledge in semiconductor manufacturing and automotive electronic qualifications.
• Strong technical proficiency in package and assembly processes is a plus.

Responsibilities

• Lead NPI process from Concept to Mass Production at OSAT.
• Define and implement Package Development for new PMIC products.
• Conduct risk assessments and implement mitigation strategies.

Skills

Communication Skills

Problem-Solving Skills

Proactive Attitude

Team Player

Education

Degree in Electronics/Electrical Engineering

Job description

Job Description

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

Qualifications

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.