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Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Failure Analysis Engineer to characterize electrical devices, isolate faults, and analyze failure mechanisms to locate defects. You will collaborate with multiple teams to resolve defects and support reliability improvements.
You will present findings, contribute to AI-enabled enhancements, and maintain fault isolation equipment readiness, while documenting experiments and learnings per standards.
Perform electrical device characterization, fault isolation, and physical failure analysis to identify failure mechanisms and defect locations.
Analyze electrical and physical failure data to determine root causes, classify defects, and support yield and reliability improvement initiatives.
Collaborate with Product Engineering, Process Integration, Test, Manufacturing, and Quality teams to resolve defectivity and product reliability issues.
Prepare and present technical findings, defect analysis results, and failure mechanism reviews to support data-driven decision-making.
Support the development, qualification, and adoption of advanced fault isolation and failure analysis techniques to enhance diagnostic capability.
Maintain the readiness, utilization, and operational effectiveness of fault isolation and failure analysis equipment.
Document experiments, analysis results, and technical learningsin accordance withorganizational standards.
Support continuous improvement initiatives for defect reduction, yield enhancement, and operational efficiency.
Contribute to knowledge sharing and best-practice development within the failure analysis function.
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
B.Sc. or higher in Electrical Engineering, Electronic Engineering, Materials Science or equivalent.
Experience in semiconductor failure analysis, fault isolation, test engineering, product engineering, yield engineering, or related discipline is preferred.
Knowledge of memory technologies such as NAND, DRAM, or HBM isadvantageous.
Electrical fault isolation methods, device characterization, and failure mechanism analysis.
Physical failure analysis techniques and defect characterization methodologies.
Root cause analysis, yield improvement, and structured problem-solving approaches.
Data analysis, statistical interpretation, and familiarity with AI-enabled or data-driven engineering analysis tools.
Structured analytical problem-solving.
Clear technical communication and presentation skills.
Cross-functional collaboration and stakeholder engagement.
Disciplined execution and attention to detail.
Learning agility and continuous improvement mindset.
Hands-on experience with advanced fault isolation and physical failure analysis tools.
Exposure to AI, machine learning, or advanced analytics applications in semiconductor engineering environments.
People -Respect, develop, and empower others
Innovation -Drive continuous improvement and breakthrough thinking
Tenacity -Show grit and determination
Collaboration -Build trust and foster teamwork
Customer Focus -Deliver excellence and value
Speed -Act with purpose and set the pace