Engineer - Bond/Grind/Trim Process Dev

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 50,000 - 80,000; Full time

Job summary

Micron Semiconductor is seeking a process development engineer in Singapore to support technology deployment and process improvement activities in 3D NAND manufacturing. The role involves ownership of process modules, collaboration with global teams, and leading complex projects critical to Micron’s objectives.

Benefits

Potential for Expat posting to Singapore

Collaborative working environment

Qualifications

• Minimum 2 years hands-on experience with Bonding/Grind/Trim equipment.
• Proven ability to collaborate with local and overseas teams.
• Excellent oral and written communication skills.

Responsibilities

• Manage process module ownership for 3D NAND development.
• Transfer processes to high volume manufacturing and address issues.
• Initiate and manage experiments for process margin improvements.

Skills

Bonding/Grind/Trim process mechanisms

Data analysis systems

Collaboration

Communication skills

Education

Bachelors' degree in Materials Science

Bachelors' degree in Chemical Engineering

Bachelors' degree in Physics

Tools

Bonding/Grind/Trim equipment

Optical metrology

Profilometry

Design of Experiments (DoE)

Job description

Micron’s NAND Technology Integration (NTI) Singapore TD group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes.
• Transfer Bonding/Grind/Trim processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address process issues working with Fab10 team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND Bonding/Grind/Trim process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions.
• Identify process simplification opportunities and drive cross functional teams in implementation.
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors’ degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experience in leading edge Bonding/Grind/Trim equipment.
• Familiarity with Bonding/Grind/Trim equipment operation, optical metrology and profilometry
• In-depth understanding of Bonding/Grind/Trim process mechanisms
• Understanding of various integration and structural impacts and constraints related to Bonding/Grind/Trim process.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects.
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

• GJS for this position: E2 and above
• Hiring Manager: HE JIAN
• Location: Fab10, 1 North Coast Drive, Singapore
• Closing Date: 31/03/2025