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Senior Staff / Principal Engineer - Automotive Package Concept

Infineon Technologies

Singapore

On-site

USD 60,000 - 100,000

Full time

3 days ago
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Job summary

An innovative firm is on the lookout for an Automotive Package Concept Engineer to shape the future of automotive applications. This role involves understanding complex automotive needs and translating them into groundbreaking packaging solutions. With a commitment to decarbonization and digitalization, you will engage with diverse teams and stakeholders, ensuring that cutting-edge technologies meet market demands. Join a global leader in semiconductor solutions, where your expertise will contribute to creating efficient energy systems and smart IoT solutions. If you're ready to make an impact in a dynamic environment, this opportunity is for you!

Qualifications

  • 5+ years of experience in semiconductor or automotive industry.
  • Deep understanding of QFN, QFP, and laminate package BoM construction.

Responsibilities

  • Translate automotive needs into package platform requirements.
  • Conduct feasibility studies and innovation projects for packaging solutions.

Skills

Automotive application knowledge
Package platform requirements
Communication skills
Problem-solving skills
Cross-functional teamwork
Fluency in English

Education

Degree in electrical/electronics engineering
Degree in material science
Degree in physics

Job description

At a glance

We are seeking an Automotive Package Concept Engineer who will delve into the needs of automotive applications and products, including mid- and long-term aspects, and transform these insights into innovative package platform requirements.

Job description

Job Description

  • Understand the automotive application and product needs (including mid-/long-term aspects) and translate into package platform requirements
  • Challenge and harmonize the requirements across all stakeholders
  • Trigger and follow-up on package solution feasibility studies, innovation and pre-development projects
  • Assess and propose the complexity of development projects in close cooperation with the package development teams
  • Align all technical, cost and quality aspects with BU, QM and project teams
  • Continuous market screening (competitor/subcontractor package portfolio) in cooperation with Reverse Engineering
  • Identify business opportunities enabled by new packaging technologies and concepts together with Application Engineering
  • Provide automotive package platform roadmap and inputs to OSAT and BE package roadmap and FE/BE unit process roadmap
  • Serve as the contact for all package-relevant topics within ATV
Your Profile

Your Profile

  • Degree in electrical/electronics engineering, material science, physics
  • More than 5 years of experience in semiconductor or automotive industry
  • Deep understanding of QFN, QFP and/or laminate package BoM construction, materials, and related production methods/processes
  • Experience working with cross-functional international teams, especially in Asia
  • Effective communication and presentation skills to engage major stakeholders
  • Strong problem-solving and decision-making skills through team collaboration, managing technical challenges openly, cooperatively, and proactively
  • Fluent in English
Why Us

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are committed to creating the best Infineon for everyone, embracing diversity and inclusion. Our environment is built on trust, openness, respect, and tolerance. We offer equal opportunities to all applicants and employees, basing decisions on experience and skills. Please inform your recruiter of any accommodations needed for the interview process.

Click here for more information about Diversity & Inclusion at Infineon.

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