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A leading company in the semiconductor industry is seeking a Process Yield Engineer to focus on yield engineering and bump process integration. The ideal candidate will collaborate with cross-functional teams to troubleshoot issues and lead continuous improvement projects. This role requires a degree in engineering and a minimum of three years of relevant experience. Strong problem-solving and analytical skills are essential for success in this position.
Responsibilities:
Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
Responsible to look into data analysis for yield and detect trend
Lead continuous improvement projects & device qualifications using APQP approach
Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production
Overall coordinator of customer's initiated BKM exercise
Requirements:
Degree in Engineering
Minimum 3 years of relevant experience preferably in the semiconductor industry
Familiar with SPC, APQP, and data analysis tools
Strong problem-solving and analytical skills