Director, Advanced Packaging Technology Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; USD 120,000 - 180,000; Full time

Job summary

An established industry player is seeking a Director for their Advanced Packaging Technology Development team. This pivotal role involves leading strategic initiatives for high-performance products, collaborating with partners to implement impactful strategies, and ensuring the delivery of cost-effective solutions. The ideal candidate will possess a strong technical background in semiconductor processes and a proven track record in leadership and problem-solving. Join a forward-thinking organization committed to innovation and excellence, where your expertise will drive significant advancements in technology and product development.

Qualifications

• 10+ years in semiconductor process or equipment development.
• Deep understanding of process flows and their impact on yield.

Responsibilities

• Lead strategic packaging initiatives for high-performance products.
• Mentor and motivate leaders and team members in APTD.

Skills

Leadership

Strategic Planning

Technical Knowledge

Problem Solving

Communication

Education

B.S/M.S./Ph.D. in Materials Science

B.S/M.S./Ph.D. in Chemical Engineering

B.S/M.S./Ph.D. in Electrical Engineering

B.S/M.S./Ph.D. in Mechanical Engineering

B.S/M.S./Ph.D. in Physics

Job description

We are looking for a Director to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include leading strategic packaging initiatives for high-performance products critical to our future. You will collaborate with internal and external partners to develop and implement strategies aligned with organizational and business objectives, delivering high-performing, cost-effective advanced packaging solutions on time with the highest quality and reliability. You will oversee package development and product transfer according to Technology Development business processes, and enhance our team's capabilities by setting ambitious goals, development objectives, and conducting performance appraisals.

You will also supervise performance metrics to identify and implement continuous improvement opportunities.

Other responsibilities include ensuring compliance with company policies and departmental procedures, providing leadership in developing and executing departmental strategies, processes, and policies through active participation in teams and projects, and mentoring other leaders to develop sustainable solutions.

Key responsibilities and duties include:

• Develop and Communicate Advanced Packaging Technology Development Strategy:

• Develop and communicate strategic objectives for APTD.

• Understand how APTD strategy impacts the overall company strategy and direction.

• Technical Leadership:

• Set long-term technical goals aligned with departmental objectives.

• Demonstrate understanding of technological complexity and effective decision-making.

• Provide technical leadership influencing company direction.

• Multi-functional Leadership:

• Represent APTD in cross-departmental leadership roles.

• Collaborate effectively with peers to develop and drive multi-functional initiatives.

• Impact and Execution:

• Use knowledge to improve quality, control costs, and enhance production efficiency.

• Ensure results are accurate, high-quality, and timely.

• Optimize resource utilization to achieve objectives.

• Meet critical milestones and goals.

• Provide strategic recommendations to align group efforts with organizational objectives.

• Make impactful decisions affecting work unit and sub-function objectives.

• Growth Mindset:

• Continuously develop new skills through goals and learning opportunities.

• Seek cross-functional opportunities, build networks, and expand domain expertise.

• Leadership Development:

• Mentor and motivate leaders and team members.

• Cultivate effective leadership skills within the team.

Education and Experience:

• B.S/M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.

• 10+ years in semiconductor process or equipment development, preferably in wafer bonding, plating, warpage control, or packaging.

• Deep understanding of process flows, interactions, and their impact on yield, performance, and reliability.

• Proven ability to guide strategic directions using extensive technical knowledge.

• Track record of problem-solving and root cause analysis.

• Ability to work effectively under tight timelines and resource constraints.

• Experience leading teams of various sizes to achieve common goals.

• Excellent communication and presentation skills at all organizational levels.

Keen on the role? Apply now!