TC Next Product Specialist

Manpower Staffing Services (S) Pte Ltd - Head Office; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

An established industry player is seeking a skilled Technical Support Engineer to provide comprehensive product and technical development support. This role involves engaging with customers, conducting feasibility studies, and troubleshooting complex issues. The ideal candidate will have a strong background in Mechanical or Electrical Engineering, with hands-on experience in semiconductor processes. You will collaborate with R&D teams to enhance product offerings and ensure customer satisfaction. If you are passionate about technology and eager to make a significant impact, this opportunity is perfect for you.

Qualifications

• Minimum 5 years in a complex Technical environment.
• Experience in product support and R&D support is essential.

Responsibilities

• Provide technical solutions and support for customer issues.
• Conduct evaluations and demos, generating reports and instructions.

Skills

Analytical Skills

Communication Skills

Problem Solving

Technical Knowledge

Education

Degree in Mechanical Engineering

Masters in Electrical Engineering

Tools

MS Office

AutoCAD

Matlab

JMP

Job description

Product and Technical Development Support

• Provides support for Thermal Compression (TC) product setup & demo
• Conducts feasibility studies, sample bonding and generate report
• Builds-up good technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team
• Defines DOE's and experimental process trials & collects Process Data
• Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding
• Understands the Thermal compression bonding process from Physics/Chemistry point of view and relate to actual bonding
• Acquires knowledge on pre and post die bonding processes
• Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve process or provide solutions to problems
• Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing
• Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless)
• Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic
• Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders.
• Collects process / production / competitor data at customer site
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM

Pre- & After Sales Support

• Conducts evaluations, demos and generate test report and instructions
• Support Sales and CPMs during Pre-Sales and demo activities
• Establishes good customer relationship on technical level with key accounts assigned
• Provides Technical Info to CPMs/Sales and/or product group.

Technical Support, 2nd Level support

• Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer
• Investigates issues at customer site and supports Engineering team for fast and short time to solution
• Provide application support for internal & external customers
• Conducts training to FSE's and Customers

Requirements
Education

• Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering

Work experience

• Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support
• Experience in production environment on Die attach/die bonding know how can be an asset
• Hands-on experience in semiconductor front end or backend Process and equipment

Expertise and methodology

• Good PC, MS-Office, AutoCad knowledge
• Matlab, JMP and statistical data analysis skills desirable
• Excellent wafer fab Front end/Backend Metrology knowledge

Other requirement criteria

• Very good analytical skills
• Excellent communication skills
• High level of assertiveness
• High degree of flexibility required
• Travel readiness up to Twenty-Five Percent

Frances Diana delos Santos, Manalo EA License No.: 02C3423 Personnel Registration No.: R1219552

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