Semicon Equipment Engineer (Wafer SAW & Laser Groove)

Semicon Equipment Engineer (Wafer SAW & Laser Groove)

Job Description:

• Responsible for maintenance and repair on any of the following equipment such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove.
• Manage a team of associate engineers.
• Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
• Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction (NPI).

Communicates with Manufacturing, Process, QA, Central Engineering (NPI) to solve issues involving other groups.

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified.