CMP Process Engineer (Manager / Senior Engineer)

Reeracoen Singapore Pte Ltd; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading manufacturing company in Singapore is seeking a talented CMP Process Engineer to develop and optimize CMP processes for advanced substrate manufacturing. The ideal candidate will have experience in process development, defect analysis, and strong collaboration skills. This role involves refining polishing recipes and ensuring high yield and quality standards.

Qualifications

• Experience in CMP process engineering in a semiconductor or advanced manufacturing environment.
• Strong understanding of process optimization and defect analysis.
• Proficient in statistical methods and data analysis techniques.

Responsibilities

• Develop and refine CMP processes for substrate manufacturing.
• Optimize polishing recipes and process parameters.
• Investigate CMP-related defects and implement monitoring techniques.

Skills

Process Development

Statistical Analysis

Cross-Functional Collaboration

Job description

Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.

Reports to: R&D Manager

Responsibilities

1. Process Development & Optimization
   • Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.
   • Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.
2. Equipment & Tooling Support
   • Define equipment specifications and validate CMP tools.
   • Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.
3. Yield & Quality Improvement
   • Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
   • Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.
4. Process Integration
   • Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
   • Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.
5. Data Analysis & Documentation
   • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
   • Document standard operating procedures (SOPs), work instructions, and control plans.
6. Cross-Functional Collaboration
   • Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
   • Assist with customer qualifications and reliability testing as needed.