Circularity Innovation Engineer — Packaging & Materials

HP; Singapore; On-site; SGD 149,000 - 233,000; Full time

Benefits offered by this job

Health insurance

Dental insurance

Vision insurance

Life insurance

Paid parental leave

Holidays

Job summary

HP is seeking a Circularity Innovation Engineer in Singapore to lead end-to-end circularity initiatives across products and packaging. You will drive renewable materials, design for circularity, and data-enabled decision making, partnering with R&D, supply chain, and suppliers to scale sustainable material use.

You will influence product architecture, enable repairability and reuse, and ensure compliance with global regulations while delivering measurable circularity improvements for HP’s

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Materials, Packaging, Environmental, or related) and 8–12+ years of experience in circular economy, packaging engineering, or sustainable materials.
• Strong cross-functional collaboration and problem-solving skills across global supply chains.
• Experience with lifecycle assessment, data systems, and circular economy reporting.

Responsibilities

• Lead development and deployment of circular packaging solutions and renewable materials across HP products.
• Integrate circularity into product design, supply chain operations, and digital data systems.
• Drive compliance with global requirements (EPR, PPWR) and sustainability standards.
• Advance reuse, repair, and takeback programs across HP portfolios.
• Partner with R&D, procurement, and suppliers to scale circular material sourcing.
• Deliver data-driven decision support and audit-ready sustainability reporting.

Job description

HP is seeking a Circularity Innovation Engineer in Singapore to lead end-to-end circularity initiatives across products and packaging. You will drive renewable materials, design for circularity, and data-enabled decision making, partnering with R&D, supply chain, and suppliers to scale sustainable material use.

You will influence product architecture, enable repairability and reuse, and ensure compliance with global regulations while delivering measurable circularity improvements for HP’s