BOE Wafer Process Owner: Precision Etch & Yield Leader

STMicroelectronics Asia Pacific Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

STMicroelectronics Asia Pacific Pte Ltd in Singapore seeks a motivated Buffered Oxide Etch Wafer Process Owner to own and optimize the BOE wet etch process used in wafer patterning and oxide opening applications.

This role collaborates with lithography, etch, integration, metrology, yield and manufacturing teams to ensure process stability, drive improvements, and support transfers for new products.

Qualifications

• Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Chemistry, Physics, or a related field.
• At least 2 years experience in semiconductor wet processing, oxide etch, or pattern transfer applications.
• Strong understanding of BOE chemistry, wet etch behavior, and process control.

Responsibilities

• Support process characterization, qualification, and continuous improvement activities.
• Collaborate with lithography, etch, integration, yield, and quality teams to resolve process issues.
• Conduct root cause analysis for excursions, yield loss, and defectivity concerns.
• Support SPC monitoring, process capability improvement, and change control activities.
• Qualify new chemistries, equipment changes, and recipe updates as needed.
• Support technology transfers and new product introductions.

Skills

Root cause analysis

SPC

DOE methodologies

Cross-functional teamwork

Analytical skills

Communication

Education

Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Chemistry, Physics, or a related field

Tools

BOE chemistry

Job description

STMicroelectronics Asia Pacific Pte Ltd in Singapore seeks a motivated Buffered Oxide Etch Wafer Process Owner to own and optimize the BOE wet etch process used in wafer patterning and oxide opening applications.

This role collaborates with lithography, etch, integration, metrology, yield and manufacturing teams to ensure process stability, drive improvements, and support transfers for new products.