BOE Process Owner: Wafer Patterning & Yield Lead

STMicroelectronics; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STMicroelectronics in Singapore is seeking a motivated Buffered Oxide Etch Wafer Process Owner to own and optimize the BOE wet etch process used in wafer patterning and oxide opening applications. You will ensure precise, uniform oxide removal to support accurate pattern transfer and high device quality.

You will collaborate with lithography, etch, integration, metrology, yield, and manufacturing teams to maintain process stability, troubleshoot excursions, and drive continuous improvement.

Qualifications

• Bachelor's or Master's degree in Chemical Engineering, Materials Science, Chemistry, Physics, or related field.
• At least 2 years of experience in semiconductor wet processing, oxide etch, or pattern transfer.
• Strong understanding of BOE chemistry, wet etch behavior, and process control.
• Experience with root cause analysis, DOE, and SPC methodologies.

Responsibilities

• Support process characterization, qualification, and continuous improvement activities.
• Collaborate with lithography, etch, integration, yield, and quality teams to resolve process issues.
• Conduct root cause analysis for excursions, yield loss, and defectivity concerns.
• Support SPC monitoring, process capability improvement, and change control activities.
• Qualify new chemistries, equipment changes, and recipe updates as needed.
• Support technology transfers and new product introductions.

Skills

BOE chemistry

Wet etch process

DOE methods

Root cause analysis

SPC

Cross-functional work

Education

Bachelor's or Master's in Chemical Eng./Materials Science/Chemistry/Physics

Job description

STMicroelectronics in Singapore is seeking a motivated Buffered Oxide Etch Wafer Process Owner to own and optimize the BOE wet etch process used in wafer patterning and oxide opening applications. You will ensure precise, uniform oxide removal to support accurate pattern transfer and high device quality.

You will collaborate with lithography, etch, integration, metrology, yield, and manufacturing teams to maintain process stability, troubleshoot excursions, and drive continuous improvement.