Responsibilities
Responsible for daily operational equipment issues and strategize recovery actions to support production requirement
Perform equipment buy-off and qualification for machine installation, modification, upgrade and maintenance
Involve in WLCSP process (Taping & Detaping, Wafer Mount, Backgrinding, Laser Grooving, Laser Mark, Dicing, AOI, Die Sort etc)
Monitor and analyse equipment performance and reliability
Requirements
Diploma / Higher NITEC / NITEC in Electronic / Electrical / Mechanical / Mechatronics Engineering or equivalent
Tape and Reel experience in wafer level and knowledge on vision system is preferred
Possess strong analysis and good teamwork
Good communication and interpersonal skills
Able to commit to either 12-hr permanent day / night shift