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A leading electronics manufacturing company in Singapore is seeking a skilled manufacturing engineer to oversee processes including Pilot Hole Stamping and Lamination. The role calls for problem-solving abilities and knowledge of manufacturing methodologies to enhance quality and efficiency. Ideal candidates will have a background in engineering, specifically in mechanical or manufacturing fields, and be keen on continuous improvement.
Qualification:
- Diploma or Bachelor Degree in Engineering (Mechanical or Manufacturing)
Job Requirements:
- Knowledge in copper etching, photosensitive film imaging processing.
- Experience in lead-frame or PCB etching manufacturing processes.
- Skillful in problem solving techniques using statistical tools and data analysis.
- Familiar with Microsoft Office software and project management skill.
- Must have basic knowledge in Design of Experiment (DOE), SPC and other quality
tools.
- Fresh Graduate are welcome. 2-3 years’ experience in manufacturing
environment would be an advantage.
Reporting Level:
- Head of Technical
Duties & Responsibilities:
1.1 Responsible for manufacturing process at Pilot Hole Stamping, Lamination and
UV Exposure for lead frame at PES.
1.2 To resolve all daily process and products’ quality issue.
1.3 Responsible for improvement programs in Yield, Capacity, Cycle Time and
capability to achieve cost reduction.
1.4 Perform 5W1H methodology to determine root cause and implement
improvement actions on daily production lot rejects.
1.5 Perform evaluation to optimize and improve the manufacturing process
capability and yield for new products.
1.6 Qualify new materials; processes, equipment and system for continue
improvement.
1.7 Establish and generate the process control, process FMEA and operation
work Instruction documentation.
1.8 Perform SPC review.
1.9 Perform other duties that may be assigned by the superior from time to time