Application Process Engineer (Semiconductor)

Adecco; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

Adecco is seeking an Application Process Engineer for a reputable firm in Singapore. The role involves optimizing semiconductor manufacturing processes and collaborating with cross-functional teams to develop innovative packaging technologies. Candidates should have a relevant engineering degree, hands-on experience, and strong analytical skills.

Qualifications

• Experience in semiconductor Front-end/ Back-end process development preferred.
• Expertise in analytical equipment for failure mode analysis.
• Strong problem-solving and technical skills.

Responsibilities

• Develop advanced packaging technologies and processes for electronic devices.
• Collaborate with customers and partners for technical support.
• Work with internal R&D teams to develop new processes and products.

Skills

Hands-on experience with semiconductor assembly equipment

Design of Experiments (DOE)

Failure mode analysis

Stress and thermal simulation modeling

Education

Bachelor's or Master's degree in Mechanical Engineering, Material Science, Physics

Tools

SEM/EDX

CSAM

AFM

Confocal microscope

Surface profiler

ANSYS

ABACUS

Job description

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The Opportunity:

• Permanent role
• Work Location: North
• Work Hour: 8am - 5pm

Adecco is partnering with a reputable firm that designs and manufactures machines and tools used in semiconductor and electronics assembly industries. We are searcing for an Application Process Engineer to join their organization to support R&D expansion. This position will play a critical role in optimizing and characterizing semiconductor manufacturing processes. You will work closely with cross-functional teams to enhance product performance, drive automation improvements, and develop next-generation manufacturing solutions.

The Job:

• Develop advanced packaging technologies and processes for the assembly of high density and high-performance electronic devices
• Closely working with external customers and partners for technical support and joint development
• Closely working with internal R&D and product teams to develop new processes and products

The Talent:

• Min. Bachelor's or Master's degree in Mechanical Engineering, Material Science, Physics, or other relevant fields.
• Hand-on experience in various semiconductor assembly equipment is preferred
• Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
• Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, CSAM, AFM, confocal microscope, surface profiler, high power optical microscope,
• Experience in semiconductor Front-end/ Back-end process development is preferred
• Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to [e-mail] in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Loo Hui Yang
Direct Line: 9342 5045
EA License No: 91C2918
Personnel Registration Number: R11011456