Application / Process Engineer - Die Bond Tools

CAPCON SINGAPORE PTE. LTD.; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading semiconductor solutions provider in Singapore is seeking an Application/Process Engineer to support advanced die bonding applications. The role involves designing, optimizing processes, troubleshooting, and providing customer support. Candidates should have a Bachelor's or Master's degree in Engineering and 3+ years of relevant experience. This position offers opportunities for collaboration across teams and involves travel for on-site installations.

Qualifications

• 3+ years of experience in semiconductor packaging or die bonding.
• Strong knowledge of Flip-Chip, PoP, wafer-level bonding.
• Hands-on problem-solving skills in a high-tech environment.

Responsibilities

• Lead design and optimization of die bonding applications.
• Conduct troubleshooting and failure analysis of tools.
• Provide on-site customer support and training.

Skills

Advanced packaging technologies

Troubleshooting skills

Communication skills

Education

Bachelor’s or Master’s degree in Engineering

Tools

Semiconductor bonding equipment

Motion control systems

Job description

Company Overview

Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product portfolio includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package (PoP) Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders, among others. We are committed to driving innovation in semiconductor backend processes to support emerging packaging architectures and heterogeneous integration.

Position Overview

Capcon is seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands-on support to both internal teams and customers. This position requires a strong technical background, a proactive mindset, and a passion for driving technology adoption and continuous improvement in high-precision semiconductor equipment.

Key Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Excellent communication and interpersonal skills; ability to work independently and in cross-functional teams.
• Willingness to travel for customer support and on-site installations (as required).