Advanced Packaging Process Engineer (Semiconductor / Senior OR Executive Level)

STAFFKING PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading company in the electronics and semiconductor manufacturing industry is seeking a qualified individual to spearhead the development of advanced packaging processes for next-gen devices. This position involves collaborating with R&D teams and partners while optimizing assembly processes using analytical tools. Ideal candidates should possess an MPhil or PhD in relevant fields and have significant experience in semiconductor processes.

Benefits

5 days work week

AWS & VB provided

Qualifications

• Experience in semiconductor industry (3-5 years preferred).
• Knowledge of semiconductor assembly equipment and processes.
• Background in simulation modeling is a plus.

Responsibilities

• Lead development of packaging technologies for electronic devices.
• Conduct Design of Experiments to optimize assembly processes.
• Perform failure mode analysis using advanced analytical tools.

Skills

Analytical skills

Material characterization

Communication

Collaboration

Problem solving

Education

MPhil or PhD in Material Science, Physics, Engineering

Tools

ANSYS

ABAQUS

SEM/EDX

C-SAM

AFM

Job description

• 5 days work week
• Location : North East
• AWS & VB provided
Industry: Electronics & Semiconductor Manufacturing

What You’ll Do

• Spearhead the development of advanced packaging technologies and processes for next-gen electronic devices.
• Conduct Design of Experiments (DOE) to optimize semiconductor assembly processes.
• Perform failure mode analysis using a suite of advanced analytical tools (SEM/EDX, C-SAM, AFM, etc.).
• Collaborate closely with internal R&D, product, and engineering teams to translate innovation into practical manufacturing solutions.
• Partner with external customers and global partners to provide technical support and co-develop breakthrough technologies.
• Contribute to simulation activities using ANSYS or ABAQUS for stress and thermal analysis (preferred).

What You Bring

• Preferably MPhil or PhD in Material Science, Physics, Engineering, or related disciplines.
• Preferably at least around 3-5 years relevant work experience in semiconductor industry
• Prior experience with semiconductor assembly equipment and front-end/back-end process development is advantageous.
• Knowledgeable in using analytical and imaging equipment for material characterization and defect analysis.
• A background in simulation modeling is a plus.
• Strong communication skills, a collaborative mindset, and a self-driven attitude.

To Apply, kindly click on the "APPLY NOW" button.
We regret that only shortlisted candidates will be notified.

Staffking Pte Ltd (20C0358) | Chong Kar Ming (John) (R21101412)