9866 - Senior Process Engineer [ Thermo Compression Bonding ]

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading company in Singapore is seeking a TCB (Thermo Compression Bonding) Process Engineer to develop and optimize bonding processes in semiconductor packaging. The role involves evaluating materials and technologies, troubleshooting, and ensuring process compliance while maintaining documentation and standards. Candidates should have a relevant degree and 2-5 years of experience in the field.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Experience with TCB or similar bonding technologies preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Troubleshoot yield issues related to TCB bonding.
• Conduct DOE and data analysis for process validation.

Skills

Process Optimization

Troubleshooting

Data Analysis

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: #01-10 Admirax St
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Karen Lee Kai En Reg No: R22108159

The Supreme Hr Advisory Pte Ltd EA No: 14C7279