Technology Lab Director (Grenoble)

Wibit Consulting & Services (WibitCS)

España

On-site

PHP 7,813,000 - 12,074,000

Full time

14 days+

Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

A global leader in ICT solutions is looking for a technology enthusiast and engineering leader to join their Grenoble Research Center. This full-time position involves leading innovations in telecommunication and ICT hardware engineering, focusing on high-speed board architecture and module reliability. The ideal candidate has over 10 years of experience and expertise in board-level hardware architecture, fostering local partnerships and mentoring a high-performing team. Join to shape the future of high-speed telecom technology.

Qualifications

10+ years in high-speed board design, multi-physics simulation, or module reliability engineering.
Deep expertise in board-level hardware architecture & complex module engineering.
Background with major ICT/Telecom companies is a strong advantage.
Cross-cultural leadership skills, comfortable working in global teams.
Fluent in English.
Background with major ICT/Telecom companies (e.g., Ericsson, Nokia, Samsung, ZTE, Cisco) is a strong advantage.

Responsibilities

Lead engineering innovations in next-gen ICT product technologies.
Build world-class lab capabilities for competitive technologies.
Future-proof technology exploration for high-speed simulations.
Strengthen local partnerships with universities & industry leaders.
Grow & empower the engineering team.
Drive cross-cultural leadership and innovation.

Skills

High-speed board design

Multi-physics simulation

Module reliability engineering

Cross-cultural leadership

Strategic mindset

Fluent in English

Global team collaboration

Strategic R&D alignment

Job description

Our client islooking for a technology enthusiast and engineering leader to join, a global leader in ICT solutions, as they expand their Grenoble Research Center. This role focuses on high-speed board-level architecture (112 Gbps+) and module reliability, leading a high-performing team to drive cutting-edge innovations in telecom and ICT hardware engineering.

Location: Grenoble Research Center (On-site)
Industry: ICT | High-Speed Hardware | Telecommunications
Employment Type: Full-time

What You’ll Do

? Lead Engineering Innovations – Guide your team in developing next-gen ICT product technologies, tackling high-speed architecture & module reliability challenges
? Build World-Class Lab Capabilities – Establish a cutting-edge laboratory, aligning with global strategies to deliver competitive core technologies
? Future-Proof Technology Exploration – Stay at the forefront of high-speed and multi-physics simulation, sourcing and implementing breakthrough innovations
? Strengthen Local Partnerships – Foster collaborations with universities & industry leaders, expanding the company’s technological influence
? Grow & Empower the Team – Attract top engineering talent, mentor a high-performance R&D team, and engage in CSR & academic initiatives
? Cross-Cultural Leadership – Drive an open, innovative team culture, ensuring seamless collaboration across global teams

What You Bring

? 10+ years in high-speed board design, multi-physics simulation, or module reliability engineering (112 Gbps+ expertise)
? Deep expertise in board-level hardware architecture & complex module engineering
? Strategic mindset – Ability to align R&D with global technology trends and manage cross-functional projects
? Cross-cultural leadership skills, comfortable working in global teams
? Fluent in English (other languages a plus)
? Background with major ICT/Telecom companies (Ericsson, Nokia, Samsung, ZTE, Cisco, etc.) is a strong advantage