Senior CAD Engineer for Mixed-Signal IC Design

Micron Technology; Mexico; On-site; PHP 1,660,000 - 2,767,000; Full time

Job summary

Micron Technology is seeking an Engineer CAD at the Guadalajara Design Center to support CAD tools, flows, and collateral for HBM design teams.

You will collaborate with HBM design, layout, and verification teams to deliver advanced capabilities and best practices across mixed-signal IC design, including timing, power, and reliability analysis, up to tape-out. Experience in memory design and AI-driven approaches is valued.

Qualifications

• Bachelor’s or preferably a Master’s/PhD in Electrical/Computer Engineering or Computer Science.
• 5+ years of direct CAD or design experience in mixed-signal, custom IC design flows.
• Experience in technical IC design or CAD teams distributed globally; use of AI is a plus.
• Familiarity with memory design (DDR3/4/5, LP3/4/5, HBM, NAND).

Responsibilities

• Provide day-to-day support for CAD tools, flows, and collateral for HBM design teams.
• Collaborate with HBM design, layout, and verification teams to enhance capabilities and methodologies.
• Support all aspects of mixed-signal, transistor-level custom IC design including place/route, P&R verification, timing and power analysis.

Skills

CAD Tools

Mixed-Signal IC Design

Artificial Intelligence

Memory Design

Education

Bachelor/Master/PhD in Electrical/Computer Engineering or Computer Science

Tools

Vendor Tools

Job description

Micron Technology is seeking an Engineer CAD at the Guadalajara Design Center to support CAD tools, flows, and collateral for HBM design teams.

You will collaborate with HBM design, layout, and verification teams to deliver advanced capabilities and best practices across mixed-signal IC design, including timing, power, and reliability analysis, up to tape-out. Experience in memory design and AI-driven approaches is valued.