Principal Engineer Package Development

Infineon Technologies AG; Muntinlupa; On-site; USD 30,000 - 50,000; Full time

Job summary

Infineon Technologies AG is seeking a Package Development Engineer to provide technical support for new product introduction at subcontractors. This role involves ensuring compliance with technical, quality, schedule, and cost requirements while collaborating with various teams to deliver innovative semiconductor solutions. Ideal candidates will have substantial experience in package/process development and strong analytical skills.

Qualifications

• At least 5 years of experience in Package/Process development within Semiconductor packaging.
• Experience in semiconductor package development.
• Proficiency in analytical tools and package simulation software.

Responsibilities

• Provide technical support for new product introduction at subcontractors.
• Ensure project meets customer requirements regarding timeline, cost, and quality.
• Propose designs for package, lead frame, substrate, and Cu-clip of new products.

Skills

Analytical

Self-driven

Statistical analysis

Education

Master’s or Bachelor’s Degree in Engineering or Physical Science

Tools

AutoCAD

ANSYS

SolidWorks

Delta Analysis

DFMEA

Job description

We are seeking a highly skilled and experienced Package Development Engineer to provide technical support for new product introduction at subcontractors. The successful candidate will ensure that technical, quality, schedule, and cost requirements are met, and that the project aligns with customer expectations in terms of timeline, cost, and quality.

Job Description

In this role, you will:

1. Provide technical support for new product introduction at subcons, ensuring achievement of technical, quality, schedule, and cost requirements.
2. Support new product/package/new process development.
3. Ensure the project meets customer requirements regarding timeline, cost, and quality.
4. Assess and mitigate technical risks.
5. Propose designs for package, lead frame, substrate, and Cu-clip of new products.
6. Collaborate closely with project managers, subcontractors, chip designers, application teams, marketing, and business units for new product design and project planning.
7. Provide technical guidance to resolve process and reliability issues.
8. Complete package development-related deliverables and documentation.
9. Develop technical documentation through Delta analysis, DFMEA, PFMEA, Process Flow, and Control plans.

Your Profile

You are suitable for this role if you have:

• A Master’s or Bachelor’s Degree in Engineering and Physical Science.
• At least 5 years of experience in Package/Process development within Semiconductor packaging.
• Experience in semiconductor package development.
• An analytical and self-driven mindset.
• Proficiency in analytical tools such as Delta Analysis, DFMEA, DoE, 8D, and simulation.
• Proficiency in AutoCAD for 2D drawings; knowledge of 3D software (e.g., AutoCAD 3D, Inventor, SolidWorks) is advantageous.
• Experience with various packages like TO, QFN, CuClip, Flip Chip, SOIC, QFP.
• Knowledge of package design rules.
• Familiarity with industry standards for package reliability testing and qualification.
• Understanding of FA techniques.
• Knowledge of assembly processes.
• Ability to interpret package simulation results and familiarity with package simulation software such as ANSYS and SolidWorks for FEA and thermal analysis.
• Strong skills in statistical analysis to guide decisions based on package/process DOE.
• Experience with DFMEA during the design phase and risk mitigation strategies.
• Knowledge of IP management and patent filing.

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