CAD Engineer

Navitas Semiconductor; Muntinlupa; On-site; PHP 600,000 - 800,000; Full time

Job summary

Navitas Semiconductor is seeking a skilled packaging and CAD drafting specialist to join the engineering team in the Philippines. You will create and maintain a directory of Bond shells and Build Diagrams for Navitas products per assembly location, and prepare bond shells for new packages with all revisions documented in the Directory.

Responsibilities include preparing single-unit drawings and per-layer layouts for routable leadframe technology, generating weekly status reports, creating 3D

Qualifications

• Bachelor’s degree in Engineering or a related technical field.
• At least 5 years experience in semiconductor package drafting support.
• Apply GD&T (Geometric dimensioning and tolerancing) in applicable drawings.
• Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.

Responsibilities

• Creates and maintains a directory of Bond shell and Build Diagrams for Navitas products per assembly location.
• Prepares bond shell for all new packages being developed and to be stored in the Directory. All revisions to the bond shell and description of change/s must be documented in the same folder.
• Prepares single-unit drawing including per layer layout for routable leadframe technology.
• Generates a weekly report for all requests received including status and completion dates for each request.
• Creates the 3D model for thermal and thermomechanical simulations. Works with Packaging engineer to define the copper alloy and materials in the stacked in preparation for the thermal simulations.
• Prepares 3D model for Preliminary and Final Datasheet of Navitas products.
• Package Outline Drawing Support: manages POD directories and drawing numbers; aligns package dimensioning per tolerances; records revision history.

Skills

GD&T

Communication

Cross-functional collaboration

Education

Bachelor’s degree in Engineering or a related technical field

Tools

AutoCAD

SolidWorks

Job description

Key Responsibilities and Duties

• Creates and maintains a directory of Bond shell and Build Diagrams for all Navitas products per assembly location
• Prepares bond shell for all new packages being developed and to be stored in an assigned folder in the Directory. All revisions to the bond shell and description of change/s must be documented in the same folder.
• Prepares single-unit drawing including per layer layout for routable leadframe technology
• Generates a weekly report for all requests received including status and completion dates for each request.
• Creates the 3D model for thermal and thermomechanical simulations. Works with Packaging engineer to define the copper alloy and materials in the stacked in preparation for the thermal simulations.
• Prepares 3D model for Preliminary and Final Datasheet of Navitas products

Bond shell and BD Drawing Support

• Creates and maintains a directory of Bond shell and Build Diagrams for all Navitas products per assembly location
• Prepares bond shell for all new packages being developed and to be stored in an assigned folder in the Directory. All revisions to the bond shell and description of change/s must be documented in the same folder.
• Prepares single-unit drawing including per layer layout for routable leadframe technology
• Generates a weekly report for all requests received including status and completion dates for each request.

3D Model Support

• Creates the 3D model for thermal and thermomechanical simulations. Works with Packaging engineer to define the copper alloy and materials in the stacked in preparation for the thermal simulations.
• Prepares 3D model for Preliminary and Final Datasheet of Navitas products

Package Outline Drawing Support

• Creates and maintains separate directories of Package Outline drawings (POD) for Released Packages and Packages that are still under development. Manages drawing number assignment to differentiate between released and non-released packages
• All corresponding changes to the POD must be captured in the revision history. Evidence on design reviews as part of the POD change must be stored in the same directory for future reference.
• Aligns all package dimensioning requirement as per acceptable tolerances of a semiconductor component.

Qualifications

• Bachelor’s degree in Engineering or a related technical field.
• At least 5 years experience in semiconductor package drafting support
• Apply GDT (Geometric dimensioning and tolerancing) in applicable drawings
• Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.

Preferred Qualifications

• Advance 2D/ 3D CAD skills (AutoCAD, Solidworks, etc)
• Familiar with semiconductor package design rules.