Senior IC/MEMS Integration and Simulation Engineer

Odd Systems; Eindhoven; Hybrid; EUR 70.000 - 110.000; Vollzeit

Zusammenfassung

Odd Systems, Eindhoven-based defense tech company, seeks an Senior IC/MEMS Integration and Simulation Engineer to design microbolometer MEMS architecture and the electrical/mechanical interface to the ROIC. You will perform FEA and thermal simulations to ensure robust packaging and operation, collaborating with MEMS processing specialists in an R&D lab in Eindhoven.

You will own MEMS layout alignment, run simulations, and feed results back into layout and process decisions, supporting Gen0

Qualifikationen

• Electrical engineering or microelectronics degree.
• Hands-on IC/layout experience, RDL a plus.
• Experience with finite element analysis for mechanical/thermal simulations.
• Understanding MEMS pixel structures and ROIC interfaces.
• Proficient English and ability to work with an international team.

Aufgaben

• Own MEMS design and layout adjustments to align microbolometer with ROIC.
• Match pixel anchor points to ROIC pad locations across revisions.
• Build and run FEA models for mechanical behavior and residual stress.
• Simulate thermal behavior during packaging to flag risks.
• Integrate simulation results into layout decisions with packaging partners.
• Maintain design docs and simulation records for Gen0 qualification.

Kenntnisse

IC layout

RDL design

English communication

Ausbildung

Electrical engineering / microelectronics degree

Tools

ANSYS

COMSOL

Jobbeschreibung

Senior IC/MEMS Integration and Simulation Engineer

Project Foundation launched byThe Fourth Law and Odd Systems isasemiconductor initiative tomass-produce thermal imaging sensors for Ukraine, the rest ofEurope and the United States.

The initiative covers the development ofLWIR sensors and the deployment ofanetwork ofpartner-operated and in-house manufacturing facilities. Itwill create anew industrial base for defense and civilian needs and supply affordable sensors tomanufacturers ofdrones, vehicles, and robotics.

The first sensors under the initiative are expected asearly as2027.

The Fourth Law isaleading Ukrainian manufacturer ofautonomy technologies for drones. Our solutions are codified according toNATO standards and are currently utilized byover 50units ofthe Security and Defense Forces ofUkraine, aswell as20+drone manufacturers.

Odd Systems isadefense technology company specializing inthe development and manufacturing ofthermal imaging cameras. Itwas founded byagroup ofentrepreneurs, engineers, managers, and tech enthusiasts with prior experience atanumber ofinternational technology companies.

Purpose of the Role:

The IC/MEMS Integration and Simulation Engineer isresponsible for designing the microbolometer MEMS architecture and the electrical and mechanical interface with the Readout Integrated Circuit (ROIC). This isahands-on role involving the design ofthe microbolometer layout and the redistribution layer (RDL) -ensuring precise alignment between pixel attachment points and the fixed pad array onthe ROIC— aswell asperforming finite element analysis toverify that the resulting structure can withstand the mechanical and thermal loads encountered during packaging and operation. The engineer works closely with aMEMS/semiconductor processing specialist and the broader technical team atthe R&D laboratory inEindhoven, and reports directly tothe Chief Technology Officer (CTO).

Office location:

Eindhoven, the Netherlands

Key Responsibilities:

• Own MEMS design and layout adjustments that reconcile the microbolometer pixel array with the fixed ROIC pad configuration.
• Match microbolometer pixel anchor points precisely topredefined ROIC pad locations, iterating layout across design revisions.
• Build and run FEA models ofmechanical behavior, including residual stress and the structural integrity ofsuspended pixel structures.
• Simulate thermal behavior across the packaging cycle— die attach, curing, wire bonding, lid sealing— toflag stress ordelamination risk before fabrication.
• Feed simulation results back into layout and process decisions, working closely with the MEMS/Semiconductor Processing Specialist and packaging partners.
• Maintain design documentation and simulation records tosupport Gen0 qualification and future design iterations.

Experience and skills weare looking for:

• Adegree inelectrical engineering, microelectronics, orarelated field, with hands-on IClayout experience (RDL design aplus).
• Practical experience with FEA tools (e.g. ANSYS, COMSOL) for mechanical and thermal simulation ofmicrostructures orpackaged devices.
• Understanding ofMEMS pixel structures, ROICpad/bump interfaces, and the constraints ofhybrid integration.
• Comfortable working from first principles inapre-production environment— this isabuild-it-yourself role, not amature-process one.
• Fluent English, with the communication maturity towork with aninternational, partly Ukrainian team.

It’s a plus ifyou have:

• Prior work onmicrobolometer, IRsensor, orother MEMS-ROIC hybrid integration.
• Experience with wafer-level ordie-level hybrid bonding processes and their mechanical failure modes.
• Familiarity with JEDEC packaging formats and wire-bond orbump interconnect design rules.
• Basedin, orwilling torelocateto, Eindhoven for the Odd Factory One R&Dlab.

Weare not just looking for employees, but for like-minded individuals who share our values and are ready tobuild the future ofUkrainian MilTech.