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TNO is seeking a Scientist in Micro-Optical Assembly & Packaging to advance optical assembly and packaging of integrated photonic systems in a hybrid Nijmegen setting. You will focus on reliable optical and electrical interfaces and scalable packaging technologies enabling chip integration into practical systems.
You will work at the interface of photonics design, materials science, and advanced packaging within PITC and CITC, collaborating with teams and industrial partners to translate
To strengthen our activities in the field of photonic integration and packaging technologies, we are looking for a Scientist Micro-Optical Assembly & Packaging.
TNO is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, TNO connects science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. By combining deep technical expertise with a focus on application, TNO supports companies and government bodies in addressing complex technological and societal challenges.
TNO plays a leading role in the field of integrated photonics through two pioneering initiatives: the Photonic Integration Technology Center (PITC) and the Chip Integration Technology Center (CITC). Both centres were established by TNO together with industrial and technology partners.
PITC focuses on the development of integrated photonic chips for applications in sectors such as mobility, healthcare, and communications. This enables innovations in areas such as traffic safety, health monitoring, and secure, energy-efficient data transmission. CITC focuses on advanced semiconductor integration and chip packaging technologies, enabling compact and versatile photonic systems.
Together, PITC and CITC provide a unique environment where photonic design, chip integration, and advanced packaging technologies come together. This environment facilitates groundbreaking research and development aimed at translating photonic innovations into scalable industrial solutions.
In this role, you will contribute to the development of advanced solutions for optical assembly and packaging of integrated photonic systems. Your work focuses on realizing reliable optical and electrical interfaces and scalable packaging technologies that enable the integration of photonic chips into practical systems and industrial applications. You work at the interface of integrated photonics, optical design, materials science, and advanced chip packaging technologies. You collaborate closely with multidisciplinary teams within PITC and CITC, including experts in photonic design, semiconductor processing, materials engineering, and system integration. In an advanced R&D environment, you contribute to the development of micro-optical assembly processes, optical interconnects, and packaging solutions that enable high-performance and reliable photonic devices.
Key responsibilities
You are a hands-on scientist with a strong analytical mindset and a keen interest in integrated photonics and advanced chip packaging technologies.
Your qualifications:
Challenging and varied work with a real impact. And plenty of opportunities as, at TNO, you are in charge of shaping your career. We offer a gross monthly salary (based on your knowledge and experience), 8% holiday pay, a 13th month bonus of 8.33% and a flex budget (5.58% + € 180). In addition, you will be given every opportunity to develop yourself.
TNO offers optional employee benefits, enabling you to tailor your benefits package to match your personal situation. You may also expect:
TNO as an employer
Our people are at the heart of TNO. Their curiosity, expertise and entrepreneurial mindset make it possible to deliver high-impact research and innovations that contribute to society’s sustainable wellbeing and prosperity. That is why we invest in an inspiring working environment where colleagues can excel, have autonomy and continue to grow.
Your talent and ambition have every opportunity to flourish at TNO. You work with experts, have access to advanced technology and the freedom to explore, experiment and innovate. Our strength lies in independence, reliability and collaboration.