Photolithography Equipment Engineer

NXP Semiconductors NV; Netherlands; On-site; EUR 60,000 - 90,000; Full time

Job summary

NXP Semiconductors NV is seeking a Photolithography Equipment Engineer for a high-volume wafer manufacturing environment. Prior semiconductor process experience and specific exposure to lithography equipment are required. Experience with ASML PAS5500 scanners and related tools is expected.

The role emphasizes identifying faults, developing action plans to root causes, and improving maintenance procedures while training technicians and driving cost reductions in equipment and scrap.

Qualifications

• Experience in semiconductor manufacturing environments required.
• Prior photolithography equipment experience is essential.
• Experience with multiple lithography tools is preferred.

Responsibilities

• Identify and reduce recurring machine faults.
• Create hard down action plans driving to root cause.
• Develop and improve tool maintenance procedures.
• Train maintenance technicians.
• Reduce overall cost of equipment and scrap.

Skills

Semiconductor manufacturing

Photolithography

Troubleshooting

Root cause analysis

Equipment maintenance

Training technicians

Tools

ASML Scanner PAS5500

Canon Stepper

TEL ACT 8

Mark 7 track

KLA 8100

KLA SL3

KLA Archers

Onto IRIS

UVs

ASET

HRPs

Job description

Business Line Description: NXP's Front End Operations plays an essential role in the company's success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.

Job Summary:

Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.

Key Challenges:

• Identification and reduction of reoccuring machine faults
• Creation of hard down action plans driving to root cause
• Developing and improving tool maintenance procedures
• Training maintenance technicians
• Reducing overall cost of equipment and scrap