Electrical Engineer - Next Generation Camera Platform

Toptal; 's-Hertogenbosch; On-site; EUR 90,000 - 120,000; Full time

Job summary

Toptal is seeking an experienced Electrical Engineer to redesign a high-performance SOM-based carrier board, bringing prototypes from lab to life. You will collaborate with HW, firmware, and software teams to accelerate design reviews, DFM feedback, and board bring-up in a fast-paced environment.

You will lead schematic decisions, optimize power and signal integrity for high-speed interfaces, and document all test results and design choices.

Qualifications

• Bachelor's or Master's degree in Electrical or Electronics Engineering.
• 5+ years designing and bringing up high-speed embedded processor boards.
• Hands-on high-speed digital design (MIPI CSI-2, PCIe, USB 3.x, DDR) and power delivery.
• Fluent with lab equipment: oscilloscopes, power analyzers, logic analyzers, etc.
• Experience with a major EDA tool (Siemens PADS or Mentor Graphics).
• Location: able to work on-site in Den Bosch 3–5 days/week.

Responsibilities

• Contribute to schematic design and component selection for a carrier board re-spin around a high-performance SOM (LPDDR5x, UFS, MIPI CSI-2 cameras, PCIe, USB 3.x).
• Review PCB layout with a focus on power integrity, signal integrity, and high-speed interfaces.
• Work with the module vendor, external reviewers, and our contract manufacturer on design reviews and early DFM/DFA feedback.
• Prepare prototype build packages (BOM, fabrication, and assembly data) and follow up with the prototype house.
• Board bring-up and electrical validation in the lab: power sequencing, clocks, interfaces, and measurements.
• Debug hardware issues together with firmware engineers, from power rails to camera interfaces.
• Document designs, test results, and design decisions.

Skills

High-speed digital design

Power delivery design

Lab hardware proficiency

Team collaboration across HW/ FW/ SW

On-site in Den Bosch

Education

Bachelor's or Master's degree in Electrical or Electronics Engineering

Tools

Siemens PADS

Mentor Graphics

Job description

Our automated camera platforms record, stream, and analyze sports for thousands of teams worldwide using on-device AI. As an Electrical Engineer on our next-generation camera platform, you will help redesign the main processing board around a new high-performance system-on-module (SOM) and bring the first prototypes to life in the lab. You will work closely with our hardware engineers on schematic design, layout reviews, prototype builds, and board bring-up, with a strong focus on getting working hardware into the hands of the firmware and software teams quickly.

Key Responsibilities and Duties

• Contribute to schematic design and component selection for a carrier board re-spin around a high-performance SOM (LPDDR5x, UFS, MIPI CSI-2 cameras, PCIe, USB 3.x).
• Review PCB layout with a focus on power integrity, signal integrity, and high-speed interfaces.
• Work with the module vendor, external reviewers, and our contract manufacturer on design reviews and early DFM/DFA feedback.
• Prepare prototype build packages (BOM, fabrication, and assembly data) and follow up with the prototype house.
• Board bring-up and electrical validation in the lab: power sequencing, clocks, interfaces, and measurements.
• Debug hardware issues together with firmware engineers, from power rails to camera interfaces.
• Document designs, test results, and design decisions.

Desired Skills and Qualifications

Must Haves:

• Education: Bachelor's or Master's degree in Electrical or Electronics Engineering, or a related field.
• Experience: 5+ years designing and bringing up high-speed embedded processor boards (application processors or SOMs).
• Technical Skills: Hands‑on experience with high-speed digital design (MIPI CSI-2, PCIe, USB 3.x, DDR) and power delivery design.
• Lab Hardware: Fluent with lab equipment: oscilloscopes, power analyzers, logic analyzers, etc.
• EDA Tools: Experience with a major EDA tool (preferably Siemens PADS / Mentor Graphics).
• Location: Able to work on-site in Den Bosch 3–5 days/week.
• Soft Skills: Strong communication and collaboration skills, with the ability to work effectively across hardware, firmware, and software teams and across geographies.
• AI Productivity: Leverage AI tools (e.g., Claude) to augment skills and increase productivity.

Nice to Haves:

• Experience with high-performance embedded application processor modules or system-on-module carrier boards.
• Multi-camera and image sensor designs.
• Power integrity and signal integrity simulation.
• DFM work with contract manufacturers, and EMC pre‑compliance.
• Thermally constrained designs for outdoor or enclosed products.