Technologist, Packaging Engineering

Sandisk; Batu Kawan; On-site; MYR 120,000 - 160,000; Full time

Job summary

A leading company in memory storage solutions is seeking an experienced Materials Engineer to drive technology development for next generation packaging solutions. The role involves collaboration with cross-functional teams and leading in-depth investigations for robust packaging technology to meet stringent industry quality standards. Candidates should possess at least 18 years of semiconductor packaging experience, ideally with advanced knowledge of IC packaging processes.

Qualifications

• Minimum 18 years of Semiconductor Packaging Process experience.
• In-depth knowledge of IC packaging processes.
• Experience in advanced packaging architecture is desired.

Responsibilities

• Drive product, process, and materials technology roadmap solutions.
• Lead collaborations with suppliers and academia for co-development.
• Ensure compatibility of materials to meet quality standards.

Skills

Technical investigation and analysis

Cross-functional team leadership

Process qualification

Education

Master Degree or PhD in Materials Engineering

Master Degree or PhD in Mechanical Engineering

Master Degree or PhD in Physics

Master Degree or PhD in Micro-electronics

Job description

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions
• To co-drive/engage in advanced packaging conceptual to productization activities with global cross-functional teams including silicon design, product design, fab back-end, process engineering and test engineering
• To lead studies related to in-depth fundamental investigation/characterization in packaging development
• Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards
• To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products
• To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities
• To drive breakthrough in product packaging materials and process - achieving
• To strategize and lead IR5.0 Digital Transformation for Packaging process e.g. Process Digital Twins, Advanced Process Control (APC), Fault Detection Control (FDC), fundamental lab characterization and design rules definition
• Lead yield integration and detailed analysis activities in wafer level processing characterization and qualification phases
• Be the primary driver in wafer level to assembly to final product test investigation and correlation activities
• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology
  
  

Qualifications

REQUIRED:

• Master Degree or PhD in Materials Engineering / Mechanical Engineering / Physics / Micro-electronics
• Minimum 18 years of Semiconductor Packaging Process with in-depth knowledge on IC packaging processes, high-density 2.5D/3D advanced packaging architecture will be desired
  
  

Preferred

• Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions
• Experience in application of AI / ML-augmented engineering development and innovation and analytics
• Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology
• Proven experience with in-depth engagement in materials and process technology fundamentals, with materials characterization lab either internally, suppliers or other 3rd party
• Personal hands-on experience on advanced lab instruments e.g. SEM/FIB, EDX/FTIR, Shadow Moire, will be added advantage
• Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies
  
  

Skills

• Ability to lead complex technical investigation and analysis with global cross-functional teams
• Ability to work with internal development / HVM teams and external CM / OSATs / suppliers on process qualification and co-development
• Ability to lead complex technical investigation and analysis with global cross-functional teams
• Ability to drive external CM / OSATs / suppliers on process qualification and co-development
  
  

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

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